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<p>This study examines the influence of Multi-Axial Compression (MAC) and annealing on texture evolution, grain boundary behavior, and plastic anisotropy in Cu-Zn alloys. The MAC process effectively reduces the formation of dominant copper- and brass-type textures by altering the strain path, promoting a more random texture distribution and reducing anisotropy. Texture Index (TI) values show that MAC significantly brings the alloy’s texture closer to ideal isotropy. During annealing, continuous recrystallization (RX) occurs, driven by organized dislocation structures with low dislocation arrangement indication <i>M*</i> values, which means disorderly arranged dislocations are first annihilated. Additionally, the formation of Σ3 coincident site lattice (CSL) boundaries plays a crucial role in suppressing grain growth, leading to a stable microstructure. The reduction in plastic anisotropy is confirmed by tensile test results, while conventional high electrical conductivity is maintained. The combined MAC and annealing processes demonstrate a promising method for improving the formability and retaining electrical performance of Cu-Zn alloys by controlling texture evolution and plastic anisotropy.</p> Graphical Abstract <p></p>

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Effect of Multi-Axial Compression and Annealing on Texture Evolution and Plastic Anisotropy in Cu-Zn Alloys

  • 期刊论文

  • 发表日期：

    2025年3月12日

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  • Taek-Kyun Jung,
  • Je Pyo Hong,
  • Chan-Ho Jeon,
  • Young-Chul Park,
  • Jong-Soo Kim,
  • Mi-Sook Kim,
  • Hyun-Jin Kim,
  • Byeong Hong Jeong,
  • Young-Chul Shin,
  • Byungsu Shin,
  • Soong-Keun Hyun,
  • Yoon-Ok Park,
  • Kwangtae Son,
  • Chang-Hee Cho

摘要

This study examines the influence of Multi-Axial Compression (MAC) and annealing on texture evolution, grain boundary behavior, and plastic anisotropy in Cu-Zn alloys. The MAC process effectively reduces the formation of dominant copper- and brass-type textures by altering the strain path, promoting a more random texture distribution and reducing anisotropy. Texture Index (TI) values show that MAC significantly brings the alloy’s texture closer to ideal isotropy. During annealing, continuous recrystallization (RX) occurs, driven by organized dislocation structures with low dislocation arrangement indication M* values, which means disorderly arranged dislocations are first annihilated. Additionally, the formation of Σ3 coincident site lattice (CSL) boundaries plays a crucial role in suppressing grain growth, leading to a stable microstructure. The reduction in plastic anisotropy is confirmed by tensile test results, while conventional high electrical conductivity is maintained. The combined MAC and annealing processes demonstrate a promising method for improving the formability and retaining electrical performance of Cu-Zn alloys by controlling texture evolution and plastic anisotropy.

Graphical Abstract