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<p>Micro- and meso-scale voids are critical manufacturing defects arising from unsaturated resin flow during liquid composite molding (LCM), significantly compromising the structural integrity and mechanical performance of composite components. Temperature exerts a pronounced influence on void formation by modulating resin viscosity and flow front advancement, thereby affecting saturation behavior. Consequently, a rigorous understanding of temperature-void interdependence is essential for process optimization and quality assurance. In this study, a coupled flow-energy model is formulated to accurately simulate unsaturated resin infiltration under transient thermal conditions. Building upon this, a physics-informed void prediction model is developed, explicitly linking local flow saturation state to void nucleation and growth mechanisms. Model validity is quantitatively established through experimental validation, comparing high-resolution void distribution measurements against simulated void volume fractions across representative mold geometries. Subsequent parametric simulations quantify void content evolution in both 2D and 3D component configurations across a controlled temperature range. Results reveal consistent temperature-dependent trends between dimensional configurations: Micro-voids preferentially nucleate near the resin inlet due to premature gelation or air entrapment under low-flow resistance, whereas meso-voids accumulate near the outlet region owing to flow starvation and incomplete impregnation. With increasing temperature, micro-void content monotonically increases, which attributed to enhanced volatile generation and reduced resin surface tension, while meso-void content declines steadily as improved resin mobility promotes complete fiber bundle saturation. Integrated analysis of total void fraction identifies an optimal processing temperature of 70&#xa0;°C, balancing minimization of aggregate void content with practical constraints on cycle time and energy consumption. These findings underscore the necessity of thermally adaptive process control strategies to mitigate micro/meso-void formation in LCM.</p>

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Study on the Influence of Temperature on Micro- and Meso-scale Voids Caused by Unsaturated Flow in Liquid Composite Molding

  • 期刊论文

  • 发表日期：

    2026年4月30日

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  • Wenkai Yang,
  • Xinyang Lei,
  • Xinyi Wu,
  • Wengang Chen,
  • Che Zhao

摘要

Micro- and meso-scale voids are critical manufacturing defects arising from unsaturated resin flow during liquid composite molding (LCM), significantly compromising the structural integrity and mechanical performance of composite components. Temperature exerts a pronounced influence on void formation by modulating resin viscosity and flow front advancement, thereby affecting saturation behavior. Consequently, a rigorous understanding of temperature-void interdependence is essential for process optimization and quality assurance. In this study, a coupled flow-energy model is formulated to accurately simulate unsaturated resin infiltration under transient thermal conditions. Building upon this, a physics-informed void prediction model is developed, explicitly linking local flow saturation state to void nucleation and growth mechanisms. Model validity is quantitatively established through experimental validation, comparing high-resolution void distribution measurements against simulated void volume fractions across representative mold geometries. Subsequent parametric simulations quantify void content evolution in both 2D and 3D component configurations across a controlled temperature range. Results reveal consistent temperature-dependent trends between dimensional configurations: Micro-voids preferentially nucleate near the resin inlet due to premature gelation or air entrapment under low-flow resistance, whereas meso-voids accumulate near the outlet region owing to flow starvation and incomplete impregnation. With increasing temperature, micro-void content monotonically increases, which attributed to enhanced volatile generation and reduced resin surface tension, while meso-void content declines steadily as improved resin mobility promotes complete fiber bundle saturation. Integrated analysis of total void fraction identifies an optimal processing temperature of 70 °C, balancing minimization of aggregate void content with practical constraints on cycle time and energy consumption. These findings underscore the necessity of thermally adaptive process control strategies to mitigate micro/meso-void formation in LCM.