<p>Piezoelectric ceramics (PZT) are widely used in various applications such as ultrasonic sensors, medical imaging, and structural health monitoring due to their excellent dielectric properties, high mechanical strength, and outstanding piezoelectric performance. This study investigates the effects of various adhesives on the performance of PZT to meet the bonding requirements in ultrasonic and piezoelectric systems. Three adhesives-Cement glue, Loctite Super glue, and Hysol (EA-30CL) were used to bond PZT to the aluminum substrate and the performance of the bonding systems were evaluated by resonance frequency and vibration amplitude. The experimental results reveal that the mechanical properties and bonding characteristics of the adhesives have a pronounced effect on the resonance frequency and vibration amplitude of PZT. Among the three adhesives, Hysol exhibits excellent mechanical strength and stable resonant frequency, and its resonant frequency is higher than the other two adhesives. At 120 V voltage, its amplitude is 41.1 % higher than that of super glue and 116.4 % higher than that of cement glue. Through the resonance frequency and vibration amplitude, Hysol was determined to be the best adhesive for PZT bonding. These findings provide valuable insights into optimizing bonding techniques in high-performance piezoelectric applications and also establish a robust foundation for ultrasonic-assisted dicing of silicon wafers.</p>

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Investigation of the bonding performance of PZT with different adhesive systems

  • Shuo Chen,
  • Hanwei Teng,
  • Moran Xu,
  • Rendi Kurniawan,
  • Changping Li,
  • Pil Wan Han,
  • Tae Jo Ko

摘要

Piezoelectric ceramics (PZT) are widely used in various applications such as ultrasonic sensors, medical imaging, and structural health monitoring due to their excellent dielectric properties, high mechanical strength, and outstanding piezoelectric performance. This study investigates the effects of various adhesives on the performance of PZT to meet the bonding requirements in ultrasonic and piezoelectric systems. Three adhesives-Cement glue, Loctite Super glue, and Hysol (EA-30CL) were used to bond PZT to the aluminum substrate and the performance of the bonding systems were evaluated by resonance frequency and vibration amplitude. The experimental results reveal that the mechanical properties and bonding characteristics of the adhesives have a pronounced effect on the resonance frequency and vibration amplitude of PZT. Among the three adhesives, Hysol exhibits excellent mechanical strength and stable resonant frequency, and its resonant frequency is higher than the other two adhesives. At 120 V voltage, its amplitude is 41.1 % higher than that of super glue and 116.4 % higher than that of cement glue. Through the resonance frequency and vibration amplitude, Hysol was determined to be the best adhesive for PZT bonding. These findings provide valuable insights into optimizing bonding techniques in high-performance piezoelectric applications and also establish a robust foundation for ultrasonic-assisted dicing of silicon wafers.