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<p>Anti-scatter films are susceptible to adhesive strength degradation and delamination under varying temperature conditions. This study presents a cohesive zone modeling approach to characterize and evaluate the adhesive interface behavior across a temperature range from −20 °C to 60 °C. The mechanical properties of the film were obtained through tensile, shear peel, and 90-degree peel tests, enabling quantitative assessment of adhesive strength at different temperatures. Finite element analysis (FEA) was performed using Abaqus, incorporating a traction-separation model to simulate interfacial behavior. A procedure was proposed to calibrate adhesive parameters based on experimental data. The results revealed a clear decrease in adhesive strength with increasing temperature, with simulation results closely matching experimental observations. This study provides a robust methodology for evaluating temperature-dependent adhesive performance and supports the enhancement of adhesive reliability in thermally varying environments.</p>

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Thermal stress analysis of anti-scatter film using adhesive interface modeling

  • 期刊论文

  • 发表日期：

    2025年11月8日

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  • Bongjun Kim,
  • Yeongjun Son,
  • Sanghoon Lee

摘要

Anti-scatter films are susceptible to adhesive strength degradation and delamination under varying temperature conditions. This study presents a cohesive zone modeling approach to characterize and evaluate the adhesive interface behavior across a temperature range from −20 °C to 60 °C. The mechanical properties of the film were obtained through tensile, shear peel, and 90-degree peel tests, enabling quantitative assessment of adhesive strength at different temperatures. Finite element analysis (FEA) was performed using Abaqus, incorporating a traction-separation model to simulate interfacial behavior. A procedure was proposed to calibrate adhesive parameters based on experimental data. The results revealed a clear decrease in adhesive strength with increasing temperature, with simulation results closely matching experimental observations. This study provides a robust methodology for evaluating temperature-dependent adhesive performance and supports the enhancement of adhesive reliability in thermally varying environments.