<p>The efficiency and lifespan of the high-power laser diode (HPLD) are dependent on the temperature which is determined by excellent thermal design. In this study, a stacked fin heat pipe heatsink (SFHS) was developed to remove the heat generated by the HPLD. A developed model was compared with experiments at different air velocities, heat fluxes and ambient temperatures. Then, the validated mode was used to discuss the influence of the fin thickness, fin pitch, heat pipe diameter and number on the thermal performance considering the viscous sublayer. It was found that the viscous sublayer may deteriorate the convective heat exchange between the fin and air when the gap between fins is small enough. The thermal resistance of the SFHS for HPLD can be as low as 0.143 K/W. The HPLD temperature decreases with increasing heat pipe diameter and number. It indicates that the SFHS in this study is effective for the HPLD and can provide guidance for researchers and engineers.</p>

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Design and optimization of stacked fin heat pipe heatsink for high-power laser diode with considering viscous sublayer

  • Xiaobao Mo,
  • Haiyu Hua

摘要

The efficiency and lifespan of the high-power laser diode (HPLD) are dependent on the temperature which is determined by excellent thermal design. In this study, a stacked fin heat pipe heatsink (SFHS) was developed to remove the heat generated by the HPLD. A developed model was compared with experiments at different air velocities, heat fluxes and ambient temperatures. Then, the validated mode was used to discuss the influence of the fin thickness, fin pitch, heat pipe diameter and number on the thermal performance considering the viscous sublayer. It was found that the viscous sublayer may deteriorate the convective heat exchange between the fin and air when the gap between fins is small enough. The thermal resistance of the SFHS for HPLD can be as low as 0.143 K/W. The HPLD temperature decreases with increasing heat pipe diameter and number. It indicates that the SFHS in this study is effective for the HPLD and can provide guidance for researchers and engineers.