High aspect ratio metal mesh based transparent conductive film
摘要
This study presents a highly conductive transparent conductive films (TCFs) based on metal mesh with high aspect ratio (∼2.5). TCFs with a high transmittance (88.6 %) and low sheet resistance (0.35 Ω/sq) was fabricated using UV imprinting, doctor blading, and electroless plating processes. These processes are relatively simple and low-cost, making them suitable for large-scale and mass production without requiring high temperature or vacuum conditions. The high asepct ratio (∼2.5) pattern was fabricated using photolithography and then replicated into a PDMS mold. The trench patten, fabricated using UV imprinting with the PDMS mold, was filled with silver paste and then electoless plated with copper. As a result TCFs based on metal mesh with high aspect ratio (∼2.5) exhibits low sheet resistance at high transmittance, with a high figure or merit (∼30000). We believe that this TCFs, with its relatively high performance compared to other TCFs, has advantages for new applications in various optoelectronic devices.