Numerical simulation and experimental study on wetting of Sn-based solder for laser soldering

iSoldering_wetting software was used to simulate the solder wetting process in laser soldering. Based on the simulation, the range of process parameters was initially determined, and the orthogonal experimental method was used to study the impact of each process parameter on solder wetting and connection quality. Then, the components were connected to the printed circuit board (PCB) using laser soldering equipment, and the welding seam morphology was analyzed to verify the reliability of the software. Pull-out experiments were carried out to test their connection strength using a universal testing machine. The results show that the simulation of the solder wetting process using iSoldering_wetting software is reliable. Laser power 16 w, wire speed 10 mm/s, and welding time 0.7 s are the process parameters with the best wettability of Sn-based solder, and the connection strength between the component and PCB is the highest using these process parameters.