Development of an ultrasonic-assisted soldering system for Fe-based lead frame surface coating

Lead frames are core components of semiconductor integrated circuits. These frames transmit electrical signals between the semiconductor chip and PCB board, protect the chip from external moisture and shock, and serve as a supporting framework. While the demand for lead frames is rapidly increasing owing to the increase in the demand for semiconductors for automobiles and mobile devices, the recent research on semiconductors is focused on developing low-cost, eco-friendly processes. Therefore, to address these challenges, this study designs and validates an ultrasonic soldering system for an iron-based lead frame and evaluates its performance via experiments. The experimental results suggest that the proposed method is eco-friendly and decreases the production cost and time of lead frames. The proposed method achieves high-quality coating using ultrasonic waves. Finally, it can be applied to the plating process at production sites.