Microslip and energy dissipation behaviors of bonding interface considering rough morphology

Lead bonding is a crucial interconnect technology in the fabrication of semiconductor-critical devices. This study presents a mathematical model to analyze the behavior of interface contact during the microslip phenomenon at the lead bonding interface. The model considers the influence of microscopic roughness on the friction coefficient. The investigation focuses on the microslip response law under varying fractal dimensions and fractal roughness. Results reveal a non-monotonic effect of fractal dimension on the microslip response, while the influence of fractal roughness consistently increases. Furthermore, the value of the fractal dimension leading to the extreme microslip response increases with the fractal roughness.