<p>The rapidly growing field of electronic devices, with increasing computational power and the integration of new features such as AI models and compact sizes, requires effective cooling techniques for reliable operation. Vapor chambers meet these needs due to their high heat transport and spreading capabilities. This work presents the design and fabrication of a cooling package comprising a vapor chamber and an air-cooled, corrugated foam heat sink. An experimental investigation on finding better working fluids and their optimum filling amount is conducted by considering two classes of working fluids: (a) pure fluids: water and 2-propanol and (b) 2-propanol/water mixtures at different concentrations. An optimum charge amount of 35% for water and 30–35% for aqueous 2-propanol mixtures is found. Vapor chamber thermal resistance and evaporator temperature are reported for the considered working fluids at different heat inputs from 4.6 to 45 W and charge amounts from 5 to 40%. The low concentration aqueous 2-propanol mixtures, viz. 0.025, 0.05, 0.1, and 0.2 M solutions demonstrate lower evaporator temperature than pure water. This study highlights the potential benefits of using low-concentration aqueous alcohol mixtures as working fluids, which operate effectively at temperatures relevant to most electronic devices.</p>