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<p>Rapidly rising heat fluxes in compact aerospace electronics demand efficient, lightweight cooling solutions, yet the thermal performance of wire-EDM-manufacturable microchannel geometries under air cooling remains insufficiently quantified. This paper presents an experimental and CFD-based investigation of air-cooled copper microchannel heat sinks (MCHS) with rectangular, triangular, and semicircular cross-sections, designed for aerospace electronics cooling. Microchannel blocks (35&#xa0;mm × 35&#xa0;mm footprint, six channels, 2.5&#xa0;mm groove depth) were fabricated by precision CNC wire EDM from the CAD geometries used in the simulations, ensuring close dimensional correspondence between numerical and experimental models. CFD analyses in ANSYS Fluent and forced-convection experiments at inlet air velocities of 1.0&#xa0;m/s (CFD) and 1.75&#xa0;m/s (tests) were carried out to map temperature and velocity fields at three vertical locations (Z1–Z3). Across all sections, the triangular microchannel yielded the lowest outlet temperatures (reductions of roughly 5–7&#xa0;K relative to rectangular and about 10–15&#xa0;K relative to semicircular channels at comparable positions) and the highest outlet velocities, consistent between CFD and measurements. The total heat transfer rate reached about 35 mW for the triangular geometry, compared with slightly above 30 mW for the rectangular and just below 25 mW for the semicircular channel. These results quantitatively confirm that triangular channels provide superior convective cooling under laminar air flow, and demonstrate a CFD-informed, wire-EDM-based workflow for designing manufacturable microchannel heat sinks for aerospace applications.</p> Graphical abstract <p></p>

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Comparative study of heat transfer and velocity distribution in microchannel heat sinks with varied cross-sectional geometries

  • 期刊论文

  • 发表日期：

    2026年3月25日

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  • Md Shamim Shah,
  • Sudhir Kumar Singh,
  • Rajeev Ranjan,
  • Ananda Gholap

摘要

Rapidly rising heat fluxes in compact aerospace electronics demand efficient, lightweight cooling solutions, yet the thermal performance of wire-EDM-manufacturable microchannel geometries under air cooling remains insufficiently quantified. This paper presents an experimental and CFD-based investigation of air-cooled copper microchannel heat sinks (MCHS) with rectangular, triangular, and semicircular cross-sections, designed for aerospace electronics cooling. Microchannel blocks (35 mm × 35 mm footprint, six channels, 2.5 mm groove depth) were fabricated by precision CNC wire EDM from the CAD geometries used in the simulations, ensuring close dimensional correspondence between numerical and experimental models. CFD analyses in ANSYS Fluent and forced-convection experiments at inlet air velocities of 1.0 m/s (CFD) and 1.75 m/s (tests) were carried out to map temperature and velocity fields at three vertical locations (Z1–Z3). Across all sections, the triangular microchannel yielded the lowest outlet temperatures (reductions of roughly 5–7 K relative to rectangular and about 10–15 K relative to semicircular channels at comparable positions) and the highest outlet velocities, consistent between CFD and measurements. The total heat transfer rate reached about 35 mW for the triangular geometry, compared with slightly above 30 mW for the rectangular and just below 25 mW for the semicircular channel. These results quantitatively confirm that triangular channels provide superior convective cooling under laminar air flow, and demonstrate a CFD-informed, wire-EDM-based workflow for designing manufacturable microchannel heat sinks for aerospace applications.

Graphical abstract