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<p>Electrical packaging and high-performance microelectronic applications, which are critical for protecting and managing electronic components, can benefit significantly from the incorporation of polymer composites with tailored properties. Composites with high thermal conductivity (TC) are essential for efficiently dissipating heat in various electronic and thermal management applications. Meanwhile, composites with low dielectric characteristics play a crucial role in minimizing electrical interference and providing reliable insulation. To address these needs, a new class of composites is developed, reinforced with natural fillers like aloe vera (AV) and seaweed (SW), along with hexagonal boron nitride (hBN), a well-known ceramic filler with excellent thermal properties. The novelty of this work lies in investigating the synergistic effect of combining AV, SW and hBN in epoxy hybrid composites to optimise dielectric and thermal properties using a Grey Relational Analysis (GRA)-based approach. The hybrids particulate polymer (HPP) composites are prepared by means of hand layup process (HLP). The researchers explore different combinations of AV, SW and hBN fillers, with their proportions ranging from 1 to 5 wt% of the total composite material. The experimental approach is carefully designed using the Box-Behnken design methodology, to systematically investigate the influence of filler composition on the prepared composites properties. Sample 5 exhibits the highest TC due to its maximum hBN content (5 wt%). Sample 5 with increased TC is ascribed to boron nitride’s synergistic interaction with the natural fillers. Sample 1 holds preferable dielectric constant (1.16). GRA main effects reveal that increasing the wt% of boron nitride can significantly enhance the thermal conductivity (TC) of the HPP composite, while natural fillers help to maintain a low dielectric constant. The GRA process is employed to validate the optimal configurations that satisfy the desired multi-objective quality criteria.</p> Graphical Abstract <p></p>

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Optimization of dielectric constant and thermal conductivity behaviours of seaweed/aloe vera/hbn reinforced polymer composites using RSM-based GRA technique

  • 期刊论文

  • 发表日期：

    2025年8月18日

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  • Ramraji Kirubakaran,
  • Suhas Nagaraj,
  • Vikhash Anna Subramanian,
  • Saran Raj Chinnasamy,
  • Venkatachalam Gopalan,
  • Shenbaga Velu Pitchumani

摘要

Electrical packaging and high-performance microelectronic applications, which are critical for protecting and managing electronic components, can benefit significantly from the incorporation of polymer composites with tailored properties. Composites with high thermal conductivity (TC) are essential for efficiently dissipating heat in various electronic and thermal management applications. Meanwhile, composites with low dielectric characteristics play a crucial role in minimizing electrical interference and providing reliable insulation. To address these needs, a new class of composites is developed, reinforced with natural fillers like aloe vera (AV) and seaweed (SW), along with hexagonal boron nitride (hBN), a well-known ceramic filler with excellent thermal properties. The novelty of this work lies in investigating the synergistic effect of combining AV, SW and hBN in epoxy hybrid composites to optimise dielectric and thermal properties using a Grey Relational Analysis (GRA)-based approach. The hybrids particulate polymer (HPP) composites are prepared by means of hand layup process (HLP). The researchers explore different combinations of AV, SW and hBN fillers, with their proportions ranging from 1 to 5 wt% of the total composite material. The experimental approach is carefully designed using the Box-Behnken design methodology, to systematically investigate the influence of filler composition on the prepared composites properties. Sample 5 exhibits the highest TC due to its maximum hBN content (5 wt%). Sample 5 with increased TC is ascribed to boron nitride’s synergistic interaction with the natural fillers. Sample 1 holds preferable dielectric constant (1.16). GRA main effects reveal that increasing the wt% of boron nitride can significantly enhance the thermal conductivity (TC) of the HPP composite, while natural fillers help to maintain a low dielectric constant. The GRA process is employed to validate the optimal configurations that satisfy the desired multi-objective quality criteria.

Graphical Abstract