Dynamic characterization and optimization of moving platforms for enhancing precision in semiconductor point testing equipment

Ultra-precision Semiconductor Point Testing equipment stands as an essential physical device for assessing Semiconductors against severe frequency domain error criteria. Dynamic accuracy is a crucial aspect of the design process and the machine’s structural dynamics. However, there is limited work in this area. Improving dynamic performance can be achieved by the machine structure’s topology optimization. Evaluate the effect of transmission component changes and platform stiffness on positioning using FEA Code. Modal analysis compared to experimental data revealed frequency variations of 10.9%, 6.1%, and 1.4% for the first three modes. Structural analysis yielded machining speeds of 175, 200, and 225 m/s for displacements of 1, 2, and 3 mm, respectively, which were validated using laser displacement sensors. Structural motion analysis identified specific deformation and stress concentrations. After optimization, the sixth, seventh, and ninth modes’ frequencies increased by 0.1%, 4.1%, and 3.6%, respectively, allowing for weight reduction and greater stiffness. Positioning inaccuracies on the CCD have been confirmed using the 6D laser interferometer. Error budget table calculations ensure that assembly defects have a regulated effect, confirming machine characteristics and proposing ways to improve. This study presents a complete framework that incorporates FEA methodologies and provides insights for equipment design optimization. Optimizing equipment design to enhance reliability and precision, while establishing error budget guidelines for future assembly.