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<p>This study investigates the effects of cooling rate on the solidification microstructure and interfacial properties of the copper layer. Results demonstrate that cooling rate is a critical parameter controlling the interfacial metallurgical behavior and solidification structure. By designing different thermal-conductivity caps to regulate the solidification behavior of the CuSn10Pb10 layer in copper/steel plunger pump cylinders, the mechanism by which cooling rate influences microstructural homogeneity and interfacial quality was revealed. Under a water glass cap (low cooling rate: 0.18°C/s), it exhibited dispersed shrinkage porosity and coarse dendrites with Pb phase size of 9.75 ± 9.96 μm, low Sn-rich phase fraction of 2.4%, and a thick diffusion layer of 3.59 μm. Stainless steel capping at a medium cooling rate of 0.46°C/s balanced solute diffusion and heat transfer. This process refined the Pb phases to a size of 10.68 ± 11&#xa0;μm, increased the proportion of Sn-rich phases by 3.7%, and ultimately achieved defect-free bonding with an interfacial shear strength of 130&#xa0;MPa. The uncapped condition (high cooling rate: 0.60°C/s) promoted equiaxed grains (Pb size: 4.81 ± 5.51 μm, Sn-rich phase: 5.7%) but induced clustered porosity due to asymmetric heat transfer. Elemental diffusion distance decreased significantly with higher cooling rate (Cu diffusion layer reduced from 3.59 μm to 1.73 μm). A two-stage cooling process suppressed Pb migration and Sn segregation by regulating mushy zone width and undercooling.</p>

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An Attempt to Fabricate a Copper-Steel Bimetallic Composite Cylinder Block by Changing the Cooling Rate in a Continuous Furnace

  • 期刊论文

  • 发表日期：

    2026年6月15日

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  • Yahui Han,
  • Xiaoling Qi,
  • Yan Wang,
  • Xiaolin Yang,
  • Lei Shi,
  • Rongbiao Chen,
  • Donglei Yao

摘要

This study investigates the effects of cooling rate on the solidification microstructure and interfacial properties of the copper layer. Results demonstrate that cooling rate is a critical parameter controlling the interfacial metallurgical behavior and solidification structure. By designing different thermal-conductivity caps to regulate the solidification behavior of the CuSn10Pb10 layer in copper/steel plunger pump cylinders, the mechanism by which cooling rate influences microstructural homogeneity and interfacial quality was revealed. Under a water glass cap (low cooling rate: 0.18°C/s), it exhibited dispersed shrinkage porosity and coarse dendrites with Pb phase size of 9.75 ± 9.96 μm, low Sn-rich phase fraction of 2.4%, and a thick diffusion layer of 3.59 μm. Stainless steel capping at a medium cooling rate of 0.46°C/s balanced solute diffusion and heat transfer. This process refined the Pb phases to a size of 10.68 ± 11 μm, increased the proportion of Sn-rich phases by 3.7%, and ultimately achieved defect-free bonding with an interfacial shear strength of 130 MPa. The uncapped condition (high cooling rate: 0.60°C/s) promoted equiaxed grains (Pb size: 4.81 ± 5.51 μm, Sn-rich phase: 5.7%) but induced clustered porosity due to asymmetric heat transfer. Elemental diffusion distance decreased significantly with higher cooling rate (Cu diffusion layer reduced from 3.59 μm to 1.73 μm). A two-stage cooling process suppressed Pb migration and Sn segregation by regulating mushy zone width and undercooling.