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<p>This paper investigates the microstructural evolution and reliability of two high-reliability solder alloys, SABN (Sn-Ag-Bi-Ni) and SACQ (Sn-Ag-Cu-Bi-Ni), in comparison with conventional SAC305. High-temperature storage, Charpy impact, drop, and thermal cycling tests were conducted to analyze the effects of alloy composition and interfacial intermetallic compounds (IMCs). In high-temperature storage, SAC305 exhibited the fastest growth and highest roughness of the Cu<sub>6</sub>Sn<sub>5</sub> layer, whereas the Ni-doped SABN and SACQ formed smoother, more stable (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> layers. Charpy results showed that SAC305 possessed the highest absorbed impact energy, while SABN and SACQ absorbed less energy due to Bi-induced solid-solution strengthening and Ag<sub>3</sub>Sn precipitation. Reliability evaluations using CTBGA228 components identified the SAC-SABN joint (SAC305&#xa0;ball/SABN paste) as the superior performer. In drop tests, SAC-SABN achieved the best reliability, attributed to the mechanical stability of the (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> interface. In thermal cycling, SAC-SABN joints with a total Ag content between 3.0 wt.% and 4.0 wt.% exhibited superior fatigue life. This performance was driven by a microstructure featuring particle-like Ag<sub>3</sub>Sn and granular Cu<sub>6</sub>Sn<sub>5</sub>, which pinned grain boundaries and retarded crack propagation. Overall, SAC-SABN joints provided the optimal balance of drop and thermal reliability, making SABN&#xa0;paste with SAC305 balls a strong candidate for&#xa0;high-reliability electronic packages.</p>

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Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys

  • 期刊论文

  • 发表日期：

    2026年2月12日

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  • Wei-Ting Lin,
  • Chia-Jung Hsu,
  • Po-Kai Chang,
  • Kelvin Li,
  • Kuo-Shu Lin,
  • Chang-Meng Wang,
  • Albert T. Wu

摘要

This paper investigates the microstructural evolution and reliability of two high-reliability solder alloys, SABN (Sn-Ag-Bi-Ni) and SACQ (Sn-Ag-Cu-Bi-Ni), in comparison with conventional SAC305. High-temperature storage, Charpy impact, drop, and thermal cycling tests were conducted to analyze the effects of alloy composition and interfacial intermetallic compounds (IMCs). In high-temperature storage, SAC305 exhibited the fastest growth and highest roughness of the Cu6Sn5 layer, whereas the Ni-doped SABN and SACQ formed smoother, more stable (Cu,Ni)6Sn5 layers. Charpy results showed that SAC305 possessed the highest absorbed impact energy, while SABN and SACQ absorbed less energy due to Bi-induced solid-solution strengthening and Ag3Sn precipitation. Reliability evaluations using CTBGA228 components identified the SAC-SABN joint (SAC305 ball/SABN paste) as the superior performer. In drop tests, SAC-SABN achieved the best reliability, attributed to the mechanical stability of the (Cu,Ni)6Sn5 interface. In thermal cycling, SAC-SABN joints with a total Ag content between 3.0 wt.% and 4.0 wt.% exhibited superior fatigue life. This performance was driven by a microstructure featuring particle-like Ag3Sn and granular Cu6Sn5, which pinned grain boundaries and retarded crack propagation. Overall, SAC-SABN joints provided the optimal balance of drop and thermal reliability, making SABN paste with SAC305 balls a strong candidate for high-reliability electronic packages.