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<p>This study investigates the effects of Sn addition on the microstructure, precipitation behavior, and the mechanical and electrical properties of Cu–6 wt.% Ag alloys. Sn (0.1–2 wt.%) was selected for its ability to enhance mechanical strength with minimal impact on electrical conductivity, without increasing the melting difficulty of the alloy. Cu–Ag–Sn alloys were fabricated by induction melting and solidification, then subjected to thermal aging and cold deformation. The incorporation of Sn effectively suppressed discontinuous precipitation (DP) and promoted the formation of finer and more uniformly distributed Ag-rich continuous precipitates (CP), reducing the average interparticle spacing from 219.3&#xa0;nm to 89.99&#xa0;nm at 0.5 wt.% Sn. At an 80% rolling reduction, the Cu–6 wt.% Ag–0.5 wt.% Sn alloy exhibited a tensile strength of 535&#xa0;MPa and a hardness of 173 HV—representing improvements of 10.3% and 11.9%, respectively, over the Sn-free counterpart—while maintaining satisfactory electrical conductivity (63.9% IACS). Notably, the addition of Sn facilitated simultaneous enhancements in both strength and ductility, with fracture strain increasing from 7.3% to 8.7% after aging at 450&#xa0;°C followed by deformation. Mechanistic analysis indicated that precipitation strengthening was the dominant contributor to yield strength, complemented by dislocation hardening, grain boundary strengthening, and solid solution strengthening.</p>

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Effect of Sn Addition on Microstructural Evolution and Properties of Cu–Ag Alloys

  • 期刊论文

  • 发表日期：

    2025年7月23日

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  • Yupeng Zhang,
  • Lin Zhang,
  • Daoqi Zhang,
  • Xiao Guo,
  • Jingwen Du,
  • Engang Wang

摘要

This study investigates the effects of Sn addition on the microstructure, precipitation behavior, and the mechanical and electrical properties of Cu–6 wt.% Ag alloys. Sn (0.1–2 wt.%) was selected for its ability to enhance mechanical strength with minimal impact on electrical conductivity, without increasing the melting difficulty of the alloy. Cu–Ag–Sn alloys were fabricated by induction melting and solidification, then subjected to thermal aging and cold deformation. The incorporation of Sn effectively suppressed discontinuous precipitation (DP) and promoted the formation of finer and more uniformly distributed Ag-rich continuous precipitates (CP), reducing the average interparticle spacing from 219.3 nm to 89.99 nm at 0.5 wt.% Sn. At an 80% rolling reduction, the Cu–6 wt.% Ag–0.5 wt.% Sn alloy exhibited a tensile strength of 535 MPa and a hardness of 173 HV—representing improvements of 10.3% and 11.9%, respectively, over the Sn-free counterpart—while maintaining satisfactory electrical conductivity (63.9% IACS). Notably, the addition of Sn facilitated simultaneous enhancements in both strength and ductility, with fracture strain increasing from 7.3% to 8.7% after aging at 450 °C followed by deformation. Mechanistic analysis indicated that precipitation strengthening was the dominant contributor to yield strength, complemented by dislocation hardening, grain boundary strengthening, and solid solution strengthening.