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<p>In Cu hydrometallurgy, impurity ions from leaching and extraction stages enter the electrolyte during electrodeposition, potentially affecting Cu deposition. This study investigated the synergistic effects of Lix984 (a 1:1 mixture of 5-nonylsalicylaldehyde oxime and 2-hydroxy-5-nonylacetophenone oxime), thiourea (TU), and Cl<sup>-</sup> on Cu cathode morphology, current efficiency (CE), and energy consumption. Electrochemical analyses (CV, LSV, Tafel) revealed that Lix984-TU significantly improved electrical efficiency (up to 99.78%), reduced energy consumption (down to 1470 kWh/t Cu), and enhanced coating flatness, lowering surface roughness to 2.11 um. It also refined grain structure, reducing average grain size from 33.11&#xa0;nm (additive-free) to 29.06&#xa0;nm. However, Cl<sup>-</sup>, while initially promoting Cu deposition, disrupted the Lix984-TU synergy, increasing surface roughness (13.84 um) and weakening grain refinement. SEM, 3D morphology, and electrochemical tests showed competitive interference by Cl-, hindering the leveling and refining effects of Lix984-TU. This study provides insights into the complex interactions of multi-component additives, offering strategies to optimize Cu electrodeposition and enhance industrial efficiency.</p>

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Synergistic Mechanism of Multi-component Low-Concentration Additives on Copper Electrodeposition

  • 期刊论文

  • 发表日期：

    2025年7月1日

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  • Zhen Zhong,
  • Guo Lin,
  • Xiaowei Sheng,
  • Tu Hu,
  • Shixing Wang,
  • Shiwei Li,
  • Hongying Xia,
  • Libo Zhang

摘要

In Cu hydrometallurgy, impurity ions from leaching and extraction stages enter the electrolyte during electrodeposition, potentially affecting Cu deposition. This study investigated the synergistic effects of Lix984 (a 1:1 mixture of 5-nonylsalicylaldehyde oxime and 2-hydroxy-5-nonylacetophenone oxime), thiourea (TU), and Cl- on Cu cathode morphology, current efficiency (CE), and energy consumption. Electrochemical analyses (CV, LSV, Tafel) revealed that Lix984-TU significantly improved electrical efficiency (up to 99.78%), reduced energy consumption (down to 1470 kWh/t Cu), and enhanced coating flatness, lowering surface roughness to 2.11 um. It also refined grain structure, reducing average grain size from 33.11 nm (additive-free) to 29.06 nm. However, Cl-, while initially promoting Cu deposition, disrupted the Lix984-TU synergy, increasing surface roughness (13.84 um) and weakening grain refinement. SEM, 3D morphology, and electrochemical tests showed competitive interference by Cl-, hindering the leveling and refining effects of Lix984-TU. This study provides insights into the complex interactions of multi-component additives, offering strategies to optimize Cu electrodeposition and enhance industrial efficiency.