Study on the Performance of Ni-Fe/Diamond Ultrathin Dicing Blades with Different Diamond Particle Sizes
摘要
To investigate the influence of diamond particles with different sizes on the performance of ultrathin dicing blades, Ni-Fe/diamond ultrathin dicing blades with varying ratios were fabricated. Techniques including SEM, XRD, and hardness testing were utilized to assess the microstructure and crystal structure of the dicing blades. The results showed that the size of diamond particles increased, the distribution of the diamond particles improved, the deposition rate accelerated, and the hardness was gradually enhanced. However, the variation in diamond particle size did not significantly affect the crystal structure of the dicing blades. The dicing blade made of W7 (3.5–7 μm) diamond particles demonstrated exceptional durability: the friction coefficient decreased from 0.373 to 0.252, wear volume decreased from 0.045 mm3 to 0.027 mm3, with a radial wear rate of 0.124 μm/10 m. Furthermore, the cutting performance of the dicing blade was significantly improved: the deviation coefficient decreased from 0.48392 to 0.45518, with a chipping size of 3.29 μm, thereby reducing the cutting costs for silicon wafers. These results indicated that diamond particles ranging from 3.5 μm to 7 μm are the preferred option for manufacturing ultrathin dicing blades.