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<p><i>x</i>Ni (<i>x</i> = 0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) was doped into Sn-3.0Ag-0.5Cu (SAC305)/Cu joints to study the evolution of the microstructure and rate-dependent shear properties under isothermal aging (aged at 170 for 0, 250, 500 and 750&#xa0;h). Compared with Ni-free joints, Ni doping can increase the low-speed (0.1&#xa0;mm/s) shear strength fractured inside the joint alloy, while decreasing the high-speed (1000&#xa0;mm/s) shear strength showing the intermetallic compound (IMC) property. In the <i>x</i>Ni joint, Ni atoms partially replace Cu to form (Cu,Ni)<sub>6</sub>Sn<sub>5</sub>, which improves the hardness (<i>H</i>) and Young’s modulus (<i>E</i>) of Cu-Sn compounds, but decreases the <i>E</i>/<i>H</i> value from 18.6 to 17.8 which represents the plastic behavior of the IMCs. As the aging time extends, the inhibitory effect of Ni on the Cu<sub>6</sub>Sn<sub>5</sub> IMC layer deteriorates, but the inhibition effect on the Cu<sub>3</sub>Sn layer is always better. This study is of great significance for controlling the growth of interfacial compounds, stabilizing the structure, and designing and strengthening the solder connections in electronic fabrication.</p>

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The Rate-Dependent Shear Performance of Ni-Stabilized SAC/Cu Joints Under Isothermal Aging

  • 期刊论文

  • 发表日期：

    2025年2月18日

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  • Quanzhen Li,
  • Chengming Li,
  • Xiaojing Wang,
  • Shanshan Cai,
  • Ning Liu,
  • Chen Liu,
  • Shaofu Sun

摘要

xNi (x = 0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) was doped into Sn-3.0Ag-0.5Cu (SAC305)/Cu joints to study the evolution of the microstructure and rate-dependent shear properties under isothermal aging (aged at 170 for 0, 250, 500 and 750 h). Compared with Ni-free joints, Ni doping can increase the low-speed (0.1 mm/s) shear strength fractured inside the joint alloy, while decreasing the high-speed (1000 mm/s) shear strength showing the intermetallic compound (IMC) property. In the xNi joint, Ni atoms partially replace Cu to form (Cu,Ni)6Sn5, which improves the hardness (H) and Young’s modulus (E) of Cu-Sn compounds, but decreases the E/H value from 18.6 to 17.8 which represents the plastic behavior of the IMCs. As the aging time extends, the inhibitory effect of Ni on the Cu6Sn5 IMC layer deteriorates, but the inhibition effect on the Cu3Sn layer is always better. This study is of great significance for controlling the growth of interfacial compounds, stabilizing the structure, and designing and strengthening the solder connections in electronic fabrication.