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<p>This review paper compiles and provides a review of the latest and relevant research on the nanoparticle-reinforced low-temperature SnBi solder. The physical, electromigration and thermomigration, microstructural, interfacial and mechanical properties of a solder are vital to the reliability of the electronic components. Generally, reinforcement of nanoparticles is beneficial to the properties of low-temperature SnBi solder. Literature on the types of nanoparticles added to SnBi focusing on these properties is available but is not outlined in a competent review. This paper provides a significant review on this topic to provide insight into SnBi solder alloy as an alternative solder in the electronic packaging industry.</p>

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A Review: Effect of Nanoparticle Additions on the Physical, Microstructural, Interfacial and Mechanical Properties of Low Temperature SnBi Solder Alloys

  • 期刊论文

  • 发表日期：

    2025年2月24日

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  • Amares Singh,
  • Hui Leng Choo,
  • Wei Hong Tan,
  • Rajkumar Durairaj,
  • Shamini Janasekaran,
  • M. S. Senthil Saravanan

摘要

This review paper compiles and provides a review of the latest and relevant research on the nanoparticle-reinforced low-temperature SnBi solder. The physical, electromigration and thermomigration, microstructural, interfacial and mechanical properties of a solder are vital to the reliability of the electronic components. Generally, reinforcement of nanoparticles is beneficial to the properties of low-temperature SnBi solder. Literature on the types of nanoparticles added to SnBi focusing on these properties is available but is not outlined in a competent review. This paper provides a significant review on this topic to provide insight into SnBi solder alloy as an alternative solder in the electronic packaging industry.