<p>In the process of protecting ferrous materials, aluminum coating usually forms a dense oxide film on the surface of the iron-based alloy. However, the capacity of the sacrificial anode is rather insufficient. In order to solve this problem, the microstructure and electrochemical corrosion properties of Al-8Si-3Fe-xIn alloy under low chlorine conditions were studied. The results show that indium (In) dissolves to form In<sup>3+</sup> and In<sup>+</sup> reverse plating on the surface of the bare substrate to form a passivation film defect. When the In content is high, the segregated In forms an activation point in the form of a cathode phase. In activates <i>τ</i><sub>6</sub> phase to form a micro-couple, which improves the non-uniform corrosion. The In-containing corrosion products at the phase boundary hinder the diffusion of Cl<sup>−</sup>. With an increase of In content, the self-corrosion potential (<i>E</i><sub>corr</sub>) of the alloy shifts negatively, and the self-corrosion current density (<i>J</i><sub>corr</sub>) decreases from 6.477 µA/cm<sup>2</sup> to 1.352 µA/cm<sup>2</sup>, and then increases gradually. However, when the In content is 0.1%, the <i>E</i><sub>corr</sub> of the alloy changes from −0.824 V to −0.932 V, and the <i>J</i><sub>corr</sub> decreases from 6.477 µA/cm<sup>2</sup> to 4.699 µA/cm<sup>2</sup>, suggesting that the use of sacrificial anode will give the best effect.</p>

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Microstructure and electrochemical behavior of Al-8Si-3Fe-xIn coating alloy in a low chlorine environment

  • Ying Shen,
  • Jing Zhang,
  • Sharafadeen Kunle Kolawole,
  • Ya Liu,
  • Xiang-ying Zhu,
  • Jun-xiu Chen,
  • Xu-ping Su

摘要

In the process of protecting ferrous materials, aluminum coating usually forms a dense oxide film on the surface of the iron-based alloy. However, the capacity of the sacrificial anode is rather insufficient. In order to solve this problem, the microstructure and electrochemical corrosion properties of Al-8Si-3Fe-xIn alloy under low chlorine conditions were studied. The results show that indium (In) dissolves to form In3+ and In+ reverse plating on the surface of the bare substrate to form a passivation film defect. When the In content is high, the segregated In forms an activation point in the form of a cathode phase. In activates τ6 phase to form a micro-couple, which improves the non-uniform corrosion. The In-containing corrosion products at the phase boundary hinder the diffusion of Cl. With an increase of In content, the self-corrosion potential (Ecorr) of the alloy shifts negatively, and the self-corrosion current density (Jcorr) decreases from 6.477 µA/cm2 to 1.352 µA/cm2, and then increases gradually. However, when the In content is 0.1%, the Ecorr of the alloy changes from −0.824 V to −0.932 V, and the Jcorr decreases from 6.477 µA/cm2 to 4.699 µA/cm2, suggesting that the use of sacrificial anode will give the best effect.