<p>The demand for low-temperature cured conductive silver pastes increases rapidly due to the development of advanced electronic fields, such as flexible electronics. Lowering curing temperatures of conductive silver pastes is generally realized using low-boiling-point solvents. However, such solvents have a low viscosity, leading to the sedimentation of the conductive phase. Increasing the content of the highly viscous binder phase helps solve this issue, but it will lower the electric conductivity. Herein, the trade-off between curing temperature and conductivity of conductive silver pastes was overcome by applying nano-silver particles as the sedimentation inhibitor while bifunctional epoxidized cardol (E-Cardol), with flexible C₁₅ side chains that can significantly enhance the toughness, as the binder. Experiments were performed to determine chemical compositions, reveal morphologies, and measure conductive resistivity values. Conductive silver pastes with a curing temperature of 140 °C and a silver content of 65 wt.% were fabricated, exhibiting a resistivity of 3.10 × 10⁻⁵ Ω·cm, comparable to that of conventional low-temperature cured silver pastes with the silver content of 80 wt.%. Moreover, this silver paste also exhibited excellent adhesion performance and enhanced anti-folding property.</p>