<p>A novel form of copper, i.e., microscale single crystal copper cube cluster, was successfully fabricated via direct current electroplating in copper sulfate solution. The structural and morphological characteristics of microscale single crystal copper cube cluster were systematically analyzed through X-ray diffraction, scanning electron microscopy and transmission electron microscopy. It was found that microscale single crystal copper cube cluster with a cube size of approximately 18 μm and {001} crystal facets can be synthesized under electroplating conditions with a current density of 30–60 mA/cm² and a copper sulfate solution concentration of 125 g/L at room temperature. The effects of current density and copper sulfate concentration on the morphologies of the as-fabricated products were systematically investigated. This study provides a cost-effective and scalable approach for synthesizing microscale single crystal copper cube cluster, addressing the limitations of traditional methods.</p>