Scholarlink

<p>This study presents a comprehensive failure analysis of a pivot pin utilized in the commercial vehicle sector, which experienced premature failure under service conditions. A systematic investigative approach was employed, encompassing visual inspection, fractographic examination, microstructural characterization, hardness measurements, scanning electron microscopy, and energy-dispersive spectroscopy. The multi-faceted analysis revealed that the failure originated from a forging-related defect, specifically incipient melting, induced during high-temperature hot forging operations. This metallurgical anomaly compromised the structural integrity of the component, leading to its eventual failure in service. Based on the findings, it is recommended that the forging temperature parameters are critically reviewed and optimized to mitigate the recurrence of such defects and enhance the reliability of the component in future applications.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Failure of Pivot Pin Due to Incipient Melting

  • 期刊论文

  • 发表日期：

    2026年3月28日

查看全文
  • Sanjay Maity,
  • Pavankumar Sondar

摘要

This study presents a comprehensive failure analysis of a pivot pin utilized in the commercial vehicle sector, which experienced premature failure under service conditions. A systematic investigative approach was employed, encompassing visual inspection, fractographic examination, microstructural characterization, hardness measurements, scanning electron microscopy, and energy-dispersive spectroscopy. The multi-faceted analysis revealed that the failure originated from a forging-related defect, specifically incipient melting, induced during high-temperature hot forging operations. This metallurgical anomaly compromised the structural integrity of the component, leading to its eventual failure in service. Based on the findings, it is recommended that the forging temperature parameters are critically reviewed and optimized to mitigate the recurrence of such defects and enhance the reliability of the component in future applications.