<p>The aerospace system for deep space exploration normally faces extreme environment conditions, including intense vibration, temperature fluctuations and so on. Solder joint, acting as the crucial component in aerospace systems, will face significant challenges when exposed to these extreme conditions during applications, which can lead to solder joints degradation or even failure, resulting in damage to onboard electronics. This study explores recent advances in solder joint reliability evaluation methods, failure mechanisms, and analytical models for electronic and electrical products in aerospace applications. The objective is to enhance the reliability of aerospace systems, with a focus on improving the design and assessment of critical solder joints in high-performance electronics. The key contributions of this paper are as follows. A structured solder joint reliability evaluation framework has been proposed to standardize failure analysis and design validation. Mainstream computational models, simulation tools, and data-driven methods have been systematically reviewed to identify best practices for aerospace applications. A comprehensive reliability assessment process is derived, offering advanced design insights and validation techniques for future aerospace electronics. By consolidating theoretical models, experimental data, and simulation approaches, this study aims to provide engineers with robust methodologies for optimizing solder joint performance in space extreme operational environments.</p>