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<p>In advanced chip package failure investigations, electro-optical terahertz pulse reflectometry (EOTPR) simulation emerges as a robust fault isolation technique. Traditional manual methods for generating simulation models, however, are hindered by significant limitations, including their labor-intensive nature, protracted time requirements, and susceptibility to human error. To address these obstacles, an in-house automation software script was developed. This script interfaces autonomously with the design database, extracting crucial trace information and generating an optimized equivalent trace model. The automated approach substantially improves the efficiency of EOTPR model simulations, streamlines workflow, standardizes procedures, and reduces the potential for human error. The efficacy of integrating the automation script into the workflow of advanced package failure analysis was demonstrated through three case studies. This integration significantly enhanced productivity and facilitated successful root-cause investigation of advanced chip package failures.</p>

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Advanced Chip Package Fault Simulation: The Impact of Accelerated Trace Model Generation

  • 期刊论文

  • 发表日期：

    2025年6月11日

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  • Chuan Zhang,
  • John Aguada,
  • Joseph Sanchez,
  • Arpan Bhattacherjee,
  • Jane Y. Li

摘要

In advanced chip package failure investigations, electro-optical terahertz pulse reflectometry (EOTPR) simulation emerges as a robust fault isolation technique. Traditional manual methods for generating simulation models, however, are hindered by significant limitations, including their labor-intensive nature, protracted time requirements, and susceptibility to human error. To address these obstacles, an in-house automation software script was developed. This script interfaces autonomously with the design database, extracting crucial trace information and generating an optimized equivalent trace model. The automated approach substantially improves the efficiency of EOTPR model simulations, streamlines workflow, standardizes procedures, and reduces the potential for human error. The efficacy of integrating the automation script into the workflow of advanced package failure analysis was demonstrated through three case studies. This integration significantly enhanced productivity and facilitated successful root-cause investigation of advanced chip package failures.