Incorporating Time-Domain Reflectometry in Chip-Level Failure Analysis Workflow: Case Studies and Development for Volume Failure Analysis
摘要
Non-destructive electrical fault isolation (FI) techniques such as emission- and laser-based techniques have been utilized widely for chip-level failure analysis (FA). However, these techniques by themselves can sometimes be inadequate for certain failure modes. In this paper, we present six FA case studies using Time-domain Reflectometry (Electro-optical terahertz pulse reflectometry, EOTPR) in combination with the traditional FI techniques. We also present continuing development in making EOTPR accessible to the semiconductor process and packaging communities.