Enhancing Electromagnetic Compatibility of Immiscible Cu-Fe Alloy by Constructing Hierarchical Microstructure through Annealing Treatment
摘要
In this present study, annealing treatment (850 °C, 4 h) was intentionally conducted to precisely tailor the dual-phase substructure of immiscible Cu-20Fe alloy. On this basis, a multi-level hierarchical microstructure is obtained and constructed, namely with considerable Cu-rich phases being the bimodal size precipitated in primary Fe-rich phase and abundant α-Fe particles formed in matrix. Because of this, the ultimate tensile strength (UTS), yield strength (YS) and elongation (EL) could be simultaneously enhanced from 358, 231 MPa and 25.4% to 406, 305 MPa and 30.9%, specifically increased by 13.4, 32 and 22%. Meanwhile, along with improvement in electrical conductivity from 30.5 %IACS to 48.6 %IACS, the saturation magnetization (Ms) enhances from 24.6 to 28.5 emu g−1 and the coercivity (Hc) barely changes being 21.6 Oe and 22.2 Oe, respectively. Given that, it is suggested that the electromagnetic compatibility of Cu-20Fe alloy could be effectively enhanced. This present study could provide an effective and feasible strategy for enhancing the electromagnetic compatibility of Cu-Fe alloy by optimizing the dual-phase substructure via annealing treatment through solid-state phase transformation.