Ductile-to-Brittle Transition Induced by Dislocation Pileup: Surface Coating Strategy for Superior Machining of Pure Copper
摘要
Machining of high strain hardening or ductile soft metals frequently faces underestimated challenges, including poor surface quality, high energy consumption, and severe cutting force fluctuations. These issues stem from a unique sinuous material flow, characterized by continuous folding and accumulation on the chip surface. This study proposed a novel strategy of surface coating-induced microstructure regulation to significantly enhance the cutting performance of pure copper in dry conditions. Integrating finite element simulation and micromachining experiments, this work analyzed the underlying mechanisms, multi-scale chip morphology, and microstructure evolution in coated and uncoated cutting. The results revealed that the ink coating effectively modified the metal surface, reducing cutting forces by 42.4 ~ 63.6% and surface roughness by 26.9 ~ 48.8% under different parameters. The chip morphology transitioned from chaotic, mushroom-shaped folds to quasi-periodic micro-serrations, driven by coating-induced dislocation pileups near the free surface, which promoted stress concentration and crack initiation. Accordingly, this study provided a feasible and sustainable approach to control material flow and improved the cutting performance of ductile metals.