Scholarlink

<p>Copper pin-fin heat sinks are widely employed in power electronic devices for controlling energy conversion and transmission. Copper, with its superior thermal conductivity and suitability for miniaturization, meets the stringent demands of power semiconductor modules. Among cooling solutions, pin-fin heat sinks—characterized by their finned structures—substantially increase heat dissipation surface area, thereby improving thermal performance. This study focuses on the fabrication of copper pin-fin heat sinks, aiming to optimize material utilization and reduce cold forging tonnage. A finite element simulation guided approach was applied to investigate the cold forging process. The research results show that reducing the initial billet thickness from 8 to 6.5&#xa0;mm resulted in a 37.1% decrease in the billet thickness and lowered the required forging tonnage by 403&#xa0;t. Strain analysis demonstrated that plastic deformation predominantly occurred in the cylinder regions, while axial compressive stress dominated stress distribution. As the stamping speed increased, the final substrate thickness decreased from 5.3 to 5.27&#xa0;mm with a slight decrease. Increasing the stamping speed is conducive to enhancing the overall flow of the material, thereby improving the uniformity of the formed height of the cylinder. The friction coefficient has an “intermediate advantage” effect on the forming effect. When the friction coefficient is 0.15, the best balance between fluidity and uniformity can achieved. Guided by FEM simulations, experimental validation confirmed that the fabricated copper pin-fin heat sinks met dimensional specifications for cylinders with reasonable forging tonnage, validating the feasibility of the developed process.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Research on Cold Forging and Forming Process of Copper Pin-Fin Heat Sink Substrates

  • 期刊论文

  • 发表日期：

    2026年7月21日

查看全文
  • Yong Xu,
  • Fakai Chen,
  • Wei Wei,
  • Tengfei Zhang,
  • Xiangcheng Zeng,
  • Wenlong Xie

摘要

Copper pin-fin heat sinks are widely employed in power electronic devices for controlling energy conversion and transmission. Copper, with its superior thermal conductivity and suitability for miniaturization, meets the stringent demands of power semiconductor modules. Among cooling solutions, pin-fin heat sinks—characterized by their finned structures—substantially increase heat dissipation surface area, thereby improving thermal performance. This study focuses on the fabrication of copper pin-fin heat sinks, aiming to optimize material utilization and reduce cold forging tonnage. A finite element simulation guided approach was applied to investigate the cold forging process. The research results show that reducing the initial billet thickness from 8 to 6.5 mm resulted in a 37.1% decrease in the billet thickness and lowered the required forging tonnage by 403 t. Strain analysis demonstrated that plastic deformation predominantly occurred in the cylinder regions, while axial compressive stress dominated stress distribution. As the stamping speed increased, the final substrate thickness decreased from 5.3 to 5.27 mm with a slight decrease. Increasing the stamping speed is conducive to enhancing the overall flow of the material, thereby improving the uniformity of the formed height of the cylinder. The friction coefficient has an “intermediate advantage” effect on the forming effect. When the friction coefficient is 0.15, the best balance between fluidity and uniformity can achieved. Guided by FEM simulations, experimental validation confirmed that the fabricated copper pin-fin heat sinks met dimensional specifications for cylinders with reasonable forging tonnage, validating the feasibility of the developed process.