Scholarlink

<p>In this study, high-strength diffusion bonding of 6061 aluminum alloy was successfully achieved at 480&#xa0;°C using spark plasma sintering (SPS) with an Al-20Zn-10Ge interlayer. The synergistic effects of bonding temperature, pressure, and holding time on the interfacial microstructure and mechanical properties were systematically investigated. Under the optimized parameters (480&#xa0;°C, 5&#xa0;MPa, 20&#xa0;min), the bonded joint attained a tensile strength of 147.87&#xa0;MPa with a post-bonding deformation rate of only 3.32%, and a defect‑free, dense metallurgical bonding layer was formed. Ge functions through a unique “diffusion promotion‑phase regulation” synergistic mechanism: it promotes elemental diffusion and the precipitation of the Mg<sub>2</sub>Ge strengthening phase, while simultaneously inhibiting the excessive formation of the brittle β‑GeSi phase via a competitive reaction. A pressure range of 5-7&#xa0;MPa ensures adequate plastic deformation and diffusion flux; however, when the pressure is increased to 7&#xa0;MPa, the base metal properties deteriorate (tensile strength decreases by 6.15% and deformation rate increases by 58.73%). These findings are expected to provide new theoretical and technical insights into oxide film disruption, low‑temperature interfacial reaction control, and the fabrication of high‑performance joints in solid‑state bonding of aluminum alloys.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Effects of Process Parameters on Microstructure and Mechanical Properties of 6061 Aluminum Alloy in Low-Temperature SPS Diffusion Bonding

  • 期刊论文

  • 发表日期：

    2026年7月31日

查看全文
  • Dashuang Liu,
  • Jiaxiong Huang,
  • Chun Li,
  • Ping Wei,
  • Xionghui Li,
  • Xiaonan Wang,
  • Lei Zhang,
  • Laima Luo,
  • Yue Zhao

摘要

In this study, high-strength diffusion bonding of 6061 aluminum alloy was successfully achieved at 480 °C using spark plasma sintering (SPS) with an Al-20Zn-10Ge interlayer. The synergistic effects of bonding temperature, pressure, and holding time on the interfacial microstructure and mechanical properties were systematically investigated. Under the optimized parameters (480 °C, 5 MPa, 20 min), the bonded joint attained a tensile strength of 147.87 MPa with a post-bonding deformation rate of only 3.32%, and a defect‑free, dense metallurgical bonding layer was formed. Ge functions through a unique “diffusion promotion‑phase regulation” synergistic mechanism: it promotes elemental diffusion and the precipitation of the Mg2Ge strengthening phase, while simultaneously inhibiting the excessive formation of the brittle β‑GeSi phase via a competitive reaction. A pressure range of 5-7 MPa ensures adequate plastic deformation and diffusion flux; however, when the pressure is increased to 7 MPa, the base metal properties deteriorate (tensile strength decreases by 6.15% and deformation rate increases by 58.73%). These findings are expected to provide new theoretical and technical insights into oxide film disruption, low‑temperature interfacial reaction control, and the fabrication of high‑performance joints in solid‑state bonding of aluminum alloys.