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<p>Stereolithography (SLA) enables high-resolution polymer printing, yet sustainability and thermomechanical robustness remain limiting for engineering use. This study formulates a bio-based PLA-polyol photocurable resin reinforced with nano-silica (0.5‐1.5&#xa0;wt.%) and evaluates printability and performance through Fourier Transform Infrared (FTIR), Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA), Thermogravimetric Analysis (TGA), Heat Deflection Temperature (HDT), and tensile testing. Relative to neat resin, 1.0&#xa0;wt.% SiO<sub>2</sub> advances thermal stability with <i>T</i><sub>5</sub> rising from ~ 314&#xa0;to ~ 329‐330&#xa0;°C and a modest increase in char residue (≈ 4.1‐≈ 5.3%), while the main decomposition pathway and <i>T</i><sub>50</sub> (~ 423‐427&#xa0;°C) remain essentially unchanged. DMA reveals the strongest viscoelastic response at 1.0&#xa0;wt.% SiO<sub>2</sub>, where the loss-modulus peak grows from ~ 39 to ~ 58&#xa0;MPa and the glass-transition behaviour reflects improved interfacial restriction of segmental motion, excessive loading (1.5&#xa0;wt.%) attenuates these gains, consistent with agglomeration. Tensile properties are largely maintained near baseline at 1.0&#xa0;wt.% (≈ 40&#xa0;MPa strength and ≈ 1.4&#xa0;GPa modulus). SEM fractography revealed that silica addition altered the failure mechanism by increasing surface roughness and crack deflection. Low silica loading yields an SLA-printable nanocomposite with enhanced thermal stability and damping without sacrificing strength, ideal for high-precision, heat-tolerant applications.</p>

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Development and Characterization of Nano-Silica Reinforced PLA Polyol Photocurable Resin Composites Fabricated by SLA for Biomedical Applications

  • 期刊论文

  • 发表日期：

    2026年7月2日

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  • Sushil Kumar Singh,
  • Avadesh Yadav,
  • Rahul Jibhakate,
  • Hari Om Maurya,
  • Himanshu Bisaria,
  • Binayaka Nahak

摘要

Stereolithography (SLA) enables high-resolution polymer printing, yet sustainability and thermomechanical robustness remain limiting for engineering use. This study formulates a bio-based PLA-polyol photocurable resin reinforced with nano-silica (0.5‐1.5 wt.%) and evaluates printability and performance through Fourier Transform Infrared (FTIR), Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA), Thermogravimetric Analysis (TGA), Heat Deflection Temperature (HDT), and tensile testing. Relative to neat resin, 1.0 wt.% SiO2 advances thermal stability with T5 rising from ~ 314 to ~ 329‐330 °C and a modest increase in char residue (≈ 4.1‐≈ 5.3%), while the main decomposition pathway and T50 (~ 423‐427 °C) remain essentially unchanged. DMA reveals the strongest viscoelastic response at 1.0 wt.% SiO2, where the loss-modulus peak grows from ~ 39 to ~ 58 MPa and the glass-transition behaviour reflects improved interfacial restriction of segmental motion, excessive loading (1.5 wt.%) attenuates these gains, consistent with agglomeration. Tensile properties are largely maintained near baseline at 1.0 wt.% (≈ 40 MPa strength and ≈ 1.4 GPa modulus). SEM fractography revealed that silica addition altered the failure mechanism by increasing surface roughness and crack deflection. Low silica loading yields an SLA-printable nanocomposite with enhanced thermal stability and damping without sacrificing strength, ideal for high-precision, heat-tolerant applications.