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<p>Achieving robust metallurgical bonding and defect-free microstructures remains a critical challenge in fabricating steel-backed copper bearings. In this study, CuSn8P and Al-modified CuSn8Al0.5 layers were deposited onto 45 steel substrates using Cold Metal Transfer (CMT) wire-arc additive manufacturing, with a comparative analysis against conventional short-circuiting transfer (SCT). The results quantitatively demonstrate that the low-heat-input CMT process significantly mitigates excessive iron dilution and suppresses process-induced porosity compared to SCT. Crucially, 0.5&#xa0;wt.% aluminum micro-alloying played a pivotal role in optimizing solidification behavior; it eliminated coarse dendritic growth and micro-pores by narrowing the solidification range and enhancing melt fluidity. Furthermore, controlled iron dilution facilitated the precipitation of dispersed Fe-rich particles, which contributed to precipitation strengthening. Consequently, the CuSn8Al0.5 bimetallic structure achieved a superior ultimate interfacial bonding strength of 276&#xa0;MPa at an optimal welding current of 90&#xa0;A, significantly outperforming the standard CuSn8P tin bronze. The deposition layer hardness also underwent a substantial quantitative increase from ~ 90&#xa0;HV to a peak of 140&#xa0;HV, driven by the dispersion of second-phase particles. This work establishes a robust process-composition strategy for manufacturing high-performance, defect-free bimetallic bearings.</p>

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Suppressing Porosity and Enhancing Interfacial Bonding in CuSn8/Steel Bimetals via Cold Metal Transfer Wire-Arc Additive Manufacturing: The Critical Role of Al Microalloying

  • 期刊论文

  • 发表日期：

    2026年6月27日

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  • Liang Wang,
  • Gang Liang,
  • Cong-cong Xu,
  • Xiao Yin,
  • Li-ting Li,
  • Jian Zhou

摘要

Achieving robust metallurgical bonding and defect-free microstructures remains a critical challenge in fabricating steel-backed copper bearings. In this study, CuSn8P and Al-modified CuSn8Al0.5 layers were deposited onto 45 steel substrates using Cold Metal Transfer (CMT) wire-arc additive manufacturing, with a comparative analysis against conventional short-circuiting transfer (SCT). The results quantitatively demonstrate that the low-heat-input CMT process significantly mitigates excessive iron dilution and suppresses process-induced porosity compared to SCT. Crucially, 0.5 wt.% aluminum micro-alloying played a pivotal role in optimizing solidification behavior; it eliminated coarse dendritic growth and micro-pores by narrowing the solidification range and enhancing melt fluidity. Furthermore, controlled iron dilution facilitated the precipitation of dispersed Fe-rich particles, which contributed to precipitation strengthening. Consequently, the CuSn8Al0.5 bimetallic structure achieved a superior ultimate interfacial bonding strength of 276 MPa at an optimal welding current of 90 A, significantly outperforming the standard CuSn8P tin bronze. The deposition layer hardness also underwent a substantial quantitative increase from ~ 90 HV to a peak of 140 HV, driven by the dispersion of second-phase particles. This work establishes a robust process-composition strategy for manufacturing high-performance, defect-free bimetallic bearings.