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<p>Low-temperature hot-pressing sintering of silver is widely used in power chip packaging. However, the nearly closed sintered structure limits oxygen contact and can leave residual organic matter, posing potential risks to long-term device operation. This work investigated nano-silver paste sintered with varying mass fractions of silver oxide (Ag<sub>2</sub>O). Ag<sub>2</sub>O decomposes around 150&#xa0;°C, releasing oxygen and generating highly active silver nanoparticles (AgNPs), which advanced the peak sintering exothermic temperature of the AgNPs from 223.2&#xa0;°C to 160.5&#xa0;°C. A 1 wt.% Ag<sub>2</sub>O addition achieved the best results, increasing the joint shear strength to 134.1&#xa0;MPa and significantly densifying the sintered structure. Appropriate Ag<sub>2</sub>O addition also increased the proportion of Σ3 twin boundaries, strengthening the sintered microstructure. Excessive Ag<sub>2</sub>O, however, resulted in undecomposed residues and localized gas accumulation, causing microcracks and porosity aggregation, which limited further improvements in joint strength. These results demonstrated that an appropriate Ag<sub>2</sub>O addition could synergistically enhance the low-temperature sintering activity and mechanical properties of nano-silver joints, providing an effective strategy for low-temperature interconnects in electronic packaging.</p>

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Adding Silver Oxide to Achieve an Internal Oxygen Supply for Pressure-Sintered Silver Joints

  • 期刊论文

  • 发表日期：

    2026年6月20日

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  • Chuanqi Dong,
  • Bolong Dong,
  • Peng He,
  • Wenbo Zhu,
  • Mingyu Li

摘要

Low-temperature hot-pressing sintering of silver is widely used in power chip packaging. However, the nearly closed sintered structure limits oxygen contact and can leave residual organic matter, posing potential risks to long-term device operation. This work investigated nano-silver paste sintered with varying mass fractions of silver oxide (Ag2O). Ag2O decomposes around 150 °C, releasing oxygen and generating highly active silver nanoparticles (AgNPs), which advanced the peak sintering exothermic temperature of the AgNPs from 223.2 °C to 160.5 °C. A 1 wt.% Ag2O addition achieved the best results, increasing the joint shear strength to 134.1 MPa and significantly densifying the sintered structure. Appropriate Ag2O addition also increased the proportion of Σ3 twin boundaries, strengthening the sintered microstructure. Excessive Ag2O, however, resulted in undecomposed residues and localized gas accumulation, causing microcracks and porosity aggregation, which limited further improvements in joint strength. These results demonstrated that an appropriate Ag2O addition could synergistically enhance the low-temperature sintering activity and mechanical properties of nano-silver joints, providing an effective strategy for low-temperature interconnects in electronic packaging.