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<p>To investigate the effects of Ni and DT4 interlayers on the microstructure and mechanical properties of PM23/H13 bimetals, Ni and DT4 interlayers were deposited on H13 alloy steel via laser cladding, respectively. Subsequently, two bimetals, namely PM23/H13@Ni and PM23/H13@DT4, were fabricated by hot isostatic pressing diffusion bonding (HIP-PSDB). The results show that after HIP-PSDB, the average grain sizes of the laser-cladded Ni and DT4 interlayers were 46.6 and 24.8&#xa0;<i>μ</i>m, respectively. Both interlayers can effectively suppress elemental diffusion at the interface. Moreover, the overall residual stress in the Ni interlayer was lower than that in the DT4 interlayer, effectively alleviating interfacial stress concentration in the PM23/H13 bimetals. The bimetals with Ni interlayer exhibited a ultimate tensile strength and elongation of 831&#xa0;MPa and 4.8%, respectively, which were higher than those of the bimetals with DT4 interlayer, indicating that the effect of adding Ni interlayer is superior to that of adding DT4 interlayer. This process provides a novel approach for enhancing the properties of PM23/H13 bimetals.</p>

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Hot Isostatic Pressing of Solid Powders for Diffusion Bonding of PM23/H13 Bimetals: Comparative Study of Ni and DT4 Interlayers

  • 期刊论文

  • 发表日期：

    2026年6月1日

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  • Lei Gao,
  • Xue Yuan Ge,
  • Chun Guo Xu,
  • Qi Peng Hu,
  • Xiang Long Wang

摘要

To investigate the effects of Ni and DT4 interlayers on the microstructure and mechanical properties of PM23/H13 bimetals, Ni and DT4 interlayers were deposited on H13 alloy steel via laser cladding, respectively. Subsequently, two bimetals, namely PM23/H13@Ni and PM23/H13@DT4, were fabricated by hot isostatic pressing diffusion bonding (HIP-PSDB). The results show that after HIP-PSDB, the average grain sizes of the laser-cladded Ni and DT4 interlayers were 46.6 and 24.8 μm, respectively. Both interlayers can effectively suppress elemental diffusion at the interface. Moreover, the overall residual stress in the Ni interlayer was lower than that in the DT4 interlayer, effectively alleviating interfacial stress concentration in the PM23/H13 bimetals. The bimetals with Ni interlayer exhibited a ultimate tensile strength and elongation of 831 MPa and 4.8%, respectively, which were higher than those of the bimetals with DT4 interlayer, indicating that the effect of adding Ni interlayer is superior to that of adding DT4 interlayer. This process provides a novel approach for enhancing the properties of PM23/H13 bimetals.