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<p>Over the past decade, a lot of work has been reported on room-temperature-vulcanized (RTV) liquid silicone rubber (LSR)-based prototypes for flexible and wearable sensors. But little has been reported to date on RTV-LSR-115 for smart orthotic insole sensors using the direct ink writing (DIW) process. In this study, RTV-LSR-115 was chosen for its excellent flexibility, cushioning ability, and suitability for soft orthotic devices. Similar to silicone gel, the softener and hardener were mixed at a 1:1 ratio and processed using a DIW setup, which enabled the fabrication of specimens according to ASTM D638 Type IV. An experimental design (DOE) approach was used to evaluate the influence of three parameters most closely correlated with process parameters: applied pressure (Pr), infill density (ID), and printing velocity (V). The fabricated samples were mechanically tested using a universal testing machine (UTM), and the data were analyzed using a general linear model (GLM) approach for multi-response optimization. The best setting suggested by GLM was Pr = 138&#xa0;kPa, ID = 0.9&#xa0;mm, and V = 6&#xa0;mm/s, yielding a composite desirability of 0.914567. The selected samples were validated for thermal stability using thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and thermo-kinetic calculations with Thermo-Calc software, along with bond characterization by Fourier-transform infrared spectroscopy (FTIR). The fabricated prototype also confirmed its appropriateness for pressure-sensing bio-implants based on dielectric constant. The results demonstrate that the RTV-LSR-115 prototypes fabricated with DIW are promising candidates for orthotic insole sensors.</p>

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Additive Manufacturing of RTV-LSR Elastomeric Sensors for Smart Orthotic Insoles Using Direct Ink Writing

  • 期刊论文

  • 发表日期：

    2026年4月15日

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  • Minhaz Husain,
  • Gurwinder Singh,
  • Rupinder Singh,
  • Mukesh Kumar Ram

摘要

Over the past decade, a lot of work has been reported on room-temperature-vulcanized (RTV) liquid silicone rubber (LSR)-based prototypes for flexible and wearable sensors. But little has been reported to date on RTV-LSR-115 for smart orthotic insole sensors using the direct ink writing (DIW) process. In this study, RTV-LSR-115 was chosen for its excellent flexibility, cushioning ability, and suitability for soft orthotic devices. Similar to silicone gel, the softener and hardener were mixed at a 1:1 ratio and processed using a DIW setup, which enabled the fabrication of specimens according to ASTM D638 Type IV. An experimental design (DOE) approach was used to evaluate the influence of three parameters most closely correlated with process parameters: applied pressure (Pr), infill density (ID), and printing velocity (V). The fabricated samples were mechanically tested using a universal testing machine (UTM), and the data were analyzed using a general linear model (GLM) approach for multi-response optimization. The best setting suggested by GLM was Pr = 138 kPa, ID = 0.9 mm, and V = 6 mm/s, yielding a composite desirability of 0.914567. The selected samples were validated for thermal stability using thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and thermo-kinetic calculations with Thermo-Calc software, along with bond characterization by Fourier-transform infrared spectroscopy (FTIR). The fabricated prototype also confirmed its appropriateness for pressure-sensing bio-implants based on dielectric constant. The results demonstrate that the RTV-LSR-115 prototypes fabricated with DIW are promising candidates for orthotic insole sensors.