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<p>In this paper, a molecular dynamics method is used to simulate the grinding of SiC workpieces by injecting N ions onto the surface of diamond abrasive grains. By analyzing the effects of different energies and dosages on the grinding temperature, dislocations, wear and surface quality of the workpieces, it is found that high dosage with high energy injection usually increases the wear rate and grinding temperature and reduces the dislocations generated in the workpieces. The N ions injected into the diamond abrasive grains can reduce the surface roughness of the SiC after grinding. However, some parameter combinations can significantly reduce the wear rate, among which the injection combination of 150&#xa0;ions/100&#xa0;keV shows the optimal wear resistance.</p>

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Investigation on the Surface Topography and Surface/Subsurface Damage Mechanisms of SiC Grinding under Ion-Implanted Diamond Abrasive by Atomic-Scale Simulations

  • 期刊论文

  • 发表日期：

    2026年3月26日

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  • Houfu Dai,
  • Lihong Hu,
  • Muhammad Harris,
  • A. Ya. Grigoriev

摘要

In this paper, a molecular dynamics method is used to simulate the grinding of SiC workpieces by injecting N ions onto the surface of diamond abrasive grains. By analyzing the effects of different energies and dosages on the grinding temperature, dislocations, wear and surface quality of the workpieces, it is found that high dosage with high energy injection usually increases the wear rate and grinding temperature and reduces the dislocations generated in the workpieces. The N ions injected into the diamond abrasive grains can reduce the surface roughness of the SiC after grinding. However, some parameter combinations can significantly reduce the wear rate, among which the injection combination of 150 ions/100 keV shows the optimal wear resistance.