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<p>As a key semiconductor material, monocrystalline silicon is increasingly widely used in many advanced fields. Although scholars have paid great attention to its material removal mechanism, its nanocutting is still a challenging subject. In this research, the molecular dynamics model of nanocutting monocrystalline silicon is constructed by molecular dynamics method, and the atomic interaction in the model is characterized by Tersoff and Morse potential functions. The simulations are performed at a cutting speed of 100&#xa0;m/s and a cutting depth of 50&#xa0;Å. The nanocutting process of monocrystalline silicon with and without vibration assistance is systematically analyzed, and the key characteristics such as cutting force, cutting heat, chip formation, atomic phase transformation, and subsurface damage are explored. The results indicate that under the vibration nanocutting conditions: The cutting heat distribution is broader, and the average system temperature is 48.4&#xa0;K higher than that in the non-vibration nanocutting process; the tangential and normal forces are reduced by 37.0 and 23.5%, respectively; the atomic count in chips increased by 15.6%; the diamond cubic structure of monocrystalline silicon is better preserved, with 1,971 more atoms in this configuration than in non-vibration nanocutting; the depths of the subsurface damage layers on the bottom and side surfaces are reduced by 4.2 and 27.2%, respectively. The research proves that vibration nanocutting of monocrystalline silicon reduces cutting force, inhibits atomic phase transition, and significantly improves the machining efficiency and surface integrity of nanocutting monocrystalline silicon, which provides theoretical basis for ultra-precision machining of monocrystalline silicon.</p>

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Comparative Analysis of Molecular Dynamics Simulations on Nanocutting of Monocrystalline Silicon With and Without Vibration Assistance

  • 期刊论文

  • 发表日期：

    2026年3月21日

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  • Tianwen Zhou,
  • Yong Zhu,
  • Tao Chen

摘要

As a key semiconductor material, monocrystalline silicon is increasingly widely used in many advanced fields. Although scholars have paid great attention to its material removal mechanism, its nanocutting is still a challenging subject. In this research, the molecular dynamics model of nanocutting monocrystalline silicon is constructed by molecular dynamics method, and the atomic interaction in the model is characterized by Tersoff and Morse potential functions. The simulations are performed at a cutting speed of 100 m/s and a cutting depth of 50 Å. The nanocutting process of monocrystalline silicon with and without vibration assistance is systematically analyzed, and the key characteristics such as cutting force, cutting heat, chip formation, atomic phase transformation, and subsurface damage are explored. The results indicate that under the vibration nanocutting conditions: The cutting heat distribution is broader, and the average system temperature is 48.4 K higher than that in the non-vibration nanocutting process; the tangential and normal forces are reduced by 37.0 and 23.5%, respectively; the atomic count in chips increased by 15.6%; the diamond cubic structure of monocrystalline silicon is better preserved, with 1,971 more atoms in this configuration than in non-vibration nanocutting; the depths of the subsurface damage layers on the bottom and side surfaces are reduced by 4.2 and 27.2%, respectively. The research proves that vibration nanocutting of monocrystalline silicon reduces cutting force, inhibits atomic phase transition, and significantly improves the machining efficiency and surface integrity of nanocutting monocrystalline silicon, which provides theoretical basis for ultra-precision machining of monocrystalline silicon.