Scholarlink

<p>A novel additive manufacturing technique, termed deformation-assisted jet electrodeposition (DAJED), was developed to fabricate bulk nanotwinned copper. Using this method, bulk nanotwinned copper was successfully produced with a thickness exceeding 1&#xa0;mm. Performance evaluations revealed that the sample exhibited high yield strength (433&#xa0;MPa) and high toughness (3.2% uniform elongation), alongside a low electrical resistivity of 2.09 μΩcm. The microstructure of the DAJED-Cu was systematically characterized, and the growth mechanism of the nanotwins was elucidated. The structural analysis reveals that the sample exhibits preferentially oriented growth nanotwins that are parallel to the deposition direction. Analysis suggests rolling deformation during jet electrodeposition mitigates the preferential grain growth and inhibits the tip effect. Furthermore, plastic deformation altered the grain orientation during the growth process, thereby facilitating uniform deposition of nanotwins and enabling the additive manufacturing of bulk nanotwin copper.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Additive Manufacturing of Bulk Nanotwin Copper by Deformation-Assisted Jet Electrodeposition

  • 期刊论文

  • 发表日期：

    2026年2月28日

查看全文
  • Changjie Wan,
  • Yichao Feng,
  • Zihao Li,
  • Yanfei Geng,
  • Xizhang Chen,
  • Wenchang Lang,
  • Wei Xue,
  • Sergey Konovalov,
  • Tiehui Fang

摘要

A novel additive manufacturing technique, termed deformation-assisted jet electrodeposition (DAJED), was developed to fabricate bulk nanotwinned copper. Using this method, bulk nanotwinned copper was successfully produced with a thickness exceeding 1 mm. Performance evaluations revealed that the sample exhibited high yield strength (433 MPa) and high toughness (3.2% uniform elongation), alongside a low electrical resistivity of 2.09 μΩcm. The microstructure of the DAJED-Cu was systematically characterized, and the growth mechanism of the nanotwins was elucidated. The structural analysis reveals that the sample exhibits preferentially oriented growth nanotwins that are parallel to the deposition direction. Analysis suggests rolling deformation during jet electrodeposition mitigates the preferential grain growth and inhibits the tip effect. Furthermore, plastic deformation altered the grain orientation during the growth process, thereby facilitating uniform deposition of nanotwins and enabling the additive manufacturing of bulk nanotwin copper.