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<p>Microchannel heat exchangers are a research topic in the field of thermal management due to their high heat dissipation efficiency. The fabrication of microchannels by chemical etching method has the advantages of low cost, high precision, and high speed. A mixed solution of H<sub>2</sub>O<sub>2</sub> and HCl was used, and the effects of etching solution composition, temperature, and spray pressure on the etching precision of 6061 aluminum alloy were investigated. The etching reaction and etching products were explored, and the etching mechanism was revealed. The best matching of etching rate and lateral erosion amount as well as comprehensive performance were achieved when the etching was carried out at an etching temperature of 25&#xa0;°C, a spraying pressure of 0.6&#xa0;MPa, a mass fraction of HCl of 10%, and a mass fraction of H<sub>2</sub>O<sub>2</sub> of 12%. The effect of H<sub>2</sub>O<sub>2</sub> content in the etching solution on the etching rate was the most obvious, and the effect of HCl content on the measured etch volume was the most obvious. The etching products are primarily Al(OH)<sub>3</sub> and a minor quantity of Al<sub>2</sub>O<sub>3</sub>.</p>

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Etching Technology and Mechanism of the Aluminum Alloy Surface Microchannels Prepared by Chemical Etching Method

  • 期刊论文

  • 发表日期：

    2026年2月24日

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  • Yanni Wei,
  • Yipeng Wang,
  • Linghao Zhu,
  • Yifan Hu,
  • Mengfan Ma,
  • Yaru Li

摘要

Microchannel heat exchangers are a research topic in the field of thermal management due to their high heat dissipation efficiency. The fabrication of microchannels by chemical etching method has the advantages of low cost, high precision, and high speed. A mixed solution of H2O2 and HCl was used, and the effects of etching solution composition, temperature, and spray pressure on the etching precision of 6061 aluminum alloy were investigated. The etching reaction and etching products were explored, and the etching mechanism was revealed. The best matching of etching rate and lateral erosion amount as well as comprehensive performance were achieved when the etching was carried out at an etching temperature of 25 °C, a spraying pressure of 0.6 MPa, a mass fraction of HCl of 10%, and a mass fraction of H2O2 of 12%. The effect of H2O2 content in the etching solution on the etching rate was the most obvious, and the effect of HCl content on the measured etch volume was the most obvious. The etching products are primarily Al(OH)3 and a minor quantity of Al2O3.