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<p>The study investigated the influence of Y content on the microstructure and properties of SAC305 alloy solders. The results indicated that the addition of trace amounts of Y refined the β-Sn and eutectic structures, resulting in a more uniform distribution of the microstructure, and significantly enhanced the tensile strength and hardness of the alloy. The elongation reached its peak when the Y addition was 0.1&#xa0;wt.%. The addition of Y had little effect on the melting point of the alloy but effectively reduced the melting range and improved the wetting properties of the alloy solders. The Y element improved the structure of the intermetallic compound (IMC) layer formed with Cu, making it thinner and more uniform, and inhibited the vertical growth of Cu<sub>6</sub>Sn<sub>5</sub>. Y dissolved in the alloy matrix, and the resulting lattice distortion enhanced electron scattering, thereby slightly increasing the resistivity of the alloy. In terms of corrosion resistance, the addition of trace amounts of Y enhanced the overall corrosion resistance of the alloy. Comprehensive analysis suggests that Y is an effective microalloying element for improving the properties of SAC305 alloy, with the best comprehensive performance observed at a 0.1% addition level.</p>

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Effect of Y Addition on Microstructure, Mechanical and Corrosion Properties of SAC305 Solder

  • 期刊论文

  • 发表日期：

    2026年1月27日

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  • Bin Zhang,
  • Yonghua Duan,
  • Shan Xu,
  • Lishi Ma,
  • Ancang Yang,
  • Shanju Zheng,
  • Mingjun Peng,
  • Mengnie Li

摘要

The study investigated the influence of Y content on the microstructure and properties of SAC305 alloy solders. The results indicated that the addition of trace amounts of Y refined the β-Sn and eutectic structures, resulting in a more uniform distribution of the microstructure, and significantly enhanced the tensile strength and hardness of the alloy. The elongation reached its peak when the Y addition was 0.1 wt.%. The addition of Y had little effect on the melting point of the alloy but effectively reduced the melting range and improved the wetting properties of the alloy solders. The Y element improved the structure of the intermetallic compound (IMC) layer formed with Cu, making it thinner and more uniform, and inhibited the vertical growth of Cu6Sn5. Y dissolved in the alloy matrix, and the resulting lattice distortion enhanced electron scattering, thereby slightly increasing the resistivity of the alloy. In terms of corrosion resistance, the addition of trace amounts of Y enhanced the overall corrosion resistance of the alloy. Comprehensive analysis suggests that Y is an effective microalloying element for improving the properties of SAC305 alloy, with the best comprehensive performance observed at a 0.1% addition level.