Multi-field Coupling Analysis of the High-Temperature Ultrasonic Embossing Process
摘要
As situations for essential components such as aeroengines become more demanding, their production processes need to meet higher standards. Traditional forming and machining methods generally have problems, including high resistance to deformation, more wear, and a lot of heat buildup. In response, multi-energy field-assisted machining has emerged, and ultrasonic vibration-assisted machining has become exceedingly common. The goal of this work is to examine the effects of static preload, amplitude, and temperature on surface residual stress and embossing depth in high-temperature ultrasonic embossing. A numerical simulation method was used to build a thermo-mechano-acoustic coupled numerical model in order to do this. We confirmed the model’s accuracy through ultrasonic embossing experiments at room temperature. The results show that static preload has a major impact on embossing depth, accounting for 71.5% of the total variance. The key element for residual stress is ultrasonic amplitude, which makes up 38.7% of the total variance. The analysis of the multi-field coupling mechanism shows that the temperature field controls the plastic deformation process caused by static preload by making the material softer. Ultrasonic vibration increases the instantaneous stress peak, which helps plasticity form and build up in specific areas. Higher static preload causes stress to become more uniform, which lowers residual stress. These two mechanisms compete with each other. Under high amplitude, local accumulation takes over, enabling deeper embossing and more residual stress.