Scholarlink

<p>In this study, Al/Cu-graphene nanoplatelets (GNP) (Al/Cu-GNP) laminated composites were fabricated via a novel powder/foil stacking strategy combined with vacuum hot pressing at 540&#xa0;°C, 20&#xa0;MPa for 1&#xa0;h. The microstructure, mechanical properties and electrical conductivity of the composites with different Cu:GNP ratios were investigated. The results demonstrate effective bonding of Al layers via Cu-GNP intermediate layers, where Cu serves as a metallic binder and facilitates the uniform dispersion of GNP. The well-dispersed GNPs suppress the formation of continuous brittle Al<sub>2</sub>Cu IMCs, thereby enhancing interfacial toughness by deflecting cracks, and improve electrical conductivity by forming bridging networks. The bonding interface is transformed from mechanical bonding to diffusion bonding of discontinuous Al-Cu intermetallic compounds with increasing Cu:GNP ratio. Microhardness of the zone next to the interface is higher than other parts such as the Al substrate and Cu-GNP zone. Tensile strength and bending strength increase to the maximum values at a Cu:GNP ratio of 7:3, up to 183 and 57&#xa0;MPa, respectively. Meanwhile, a maximum electrical conductivity of 79.03% IACS is also achieved at this composition.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Interfacial Microstructure and Properties of Al/Cu-GNP Laminated Composites Fabricated by Vacuum Hot Pressing

  • 期刊论文

  • 发表日期：

    2025年12月23日

查看全文
  • Yunlong Li,
  • Baoxia Ma,
  • Fengchun Wang,
  • Yizhe Wu,
  • Erjun Guo,
  • Yicheng Feng

摘要

In this study, Al/Cu-graphene nanoplatelets (GNP) (Al/Cu-GNP) laminated composites were fabricated via a novel powder/foil stacking strategy combined with vacuum hot pressing at 540 °C, 20 MPa for 1 h. The microstructure, mechanical properties and electrical conductivity of the composites with different Cu:GNP ratios were investigated. The results demonstrate effective bonding of Al layers via Cu-GNP intermediate layers, where Cu serves as a metallic binder and facilitates the uniform dispersion of GNP. The well-dispersed GNPs suppress the formation of continuous brittle Al2Cu IMCs, thereby enhancing interfacial toughness by deflecting cracks, and improve electrical conductivity by forming bridging networks. The bonding interface is transformed from mechanical bonding to diffusion bonding of discontinuous Al-Cu intermetallic compounds with increasing Cu:GNP ratio. Microhardness of the zone next to the interface is higher than other parts such as the Al substrate and Cu-GNP zone. Tensile strength and bending strength increase to the maximum values at a Cu:GNP ratio of 7:3, up to 183 and 57 MPa, respectively. Meanwhile, a maximum electrical conductivity of 79.03% IACS is also achieved at this composition.