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<p>The finite element simulation and experimental investigation of the rolling process for Incoloy 825/X80 clad plates were discussed. Initially, a multi-scale thermomechanical-coupled numerical model was developed on the Deform-3D platform to precisely forecast interfacial metallurgical phenomena under intricate processing conditions. Based on the simulation predictions and considering both interfacial bonding quality and mill load capacity, the initial rolling temperature was determined to be 1100&#xa0;°C. Based on the stress–strain simulation of the interface between X80 substrate metal and Incoloy 825 cladding metal at 1100&#xa0;°C, the study employed a rolling process with a total reduction rate of 79.6% achieved in five passes. Microstructural characterization and interfacial analysis of the rolled Incoloy 825/X80 clad plates revealed an undulating bonded interface, demonstrating effective bonding. Furthermore, elemental profiles of Cr, Ni, and Fe across the interface exhibited steep gradients, indicating a diffusion distance of approximately 2.5&#xa0;μm within the Incoloy 825/X80 clad plate. Finally, the interfacial bonding mechanism was investigated, and the results demonstrated that bonding is based on a combination of diffusion and recrystallization bonding mechanisms.</p>

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Numerical Simulation Study on the Rolling Process of Incoloy 825/X80 Pipeline Steel Clad Plate

  • 期刊论文

  • 发表日期：

    2025年12月26日

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  • Chuanlong Han,
  • Min Li,
  • Yu Zhang,
  • Juan Li,
  • Guanghui Zhao,
  • Huaying Li

摘要

The finite element simulation and experimental investigation of the rolling process for Incoloy 825/X80 clad plates were discussed. Initially, a multi-scale thermomechanical-coupled numerical model was developed on the Deform-3D platform to precisely forecast interfacial metallurgical phenomena under intricate processing conditions. Based on the simulation predictions and considering both interfacial bonding quality and mill load capacity, the initial rolling temperature was determined to be 1100 °C. Based on the stress–strain simulation of the interface between X80 substrate metal and Incoloy 825 cladding metal at 1100 °C, the study employed a rolling process with a total reduction rate of 79.6% achieved in five passes. Microstructural characterization and interfacial analysis of the rolled Incoloy 825/X80 clad plates revealed an undulating bonded interface, demonstrating effective bonding. Furthermore, elemental profiles of Cr, Ni, and Fe across the interface exhibited steep gradients, indicating a diffusion distance of approximately 2.5 μm within the Incoloy 825/X80 clad plate. Finally, the interfacial bonding mechanism was investigated, and the results demonstrated that bonding is based on a combination of diffusion and recrystallization bonding mechanisms.