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<p>The grinding of microstructures with structured grinding wheels has been demonstrated to result in a substantial enhancement in preparation efficiency. However, when grinding superhard materials such as sapphire, the edges of microstructures are prone to chipping, which has a significant impact on quality. To address this, this paper proposes a tangential ultrasonic vibration grinding technology based on structured grinding wheels, analyzes its separation, motion, and grinding force characteristics, and explores its influence and mechanism of action on the edge integrity and bottom surface quality of sapphire microstructures. Through single-factor experiments combined with response surface methodology, the influence of parameters such as ultrasonic amplitude on surface roughness (Ra) was studied. A regression model was obtained, showing that the order of influence is as follows: feed speed &gt; grinding speed &gt; grinding depth &gt; ultrasonic amplitude. Under optimal parameters, the predicted Ra value is 0.313&#xa0;μm and the average measured Ra value is 0.322&#xa0;μm, with a deviation of 2.875%. Compared with conventional grinding, this technology can effectively suppress edge chipping of sapphire microstructures, providing technical support for improving the surface microstructure quality of superhard materials and optimizing process parameters.</p>

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Ultrasonic Vibratory Grinding of Microgrooves on Sapphire Surfaces with Structured Grinding Wheels

  • 期刊论文

  • 发表日期：

    2025年12月16日

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  • Fei Zhou,
  • Guoqing Zhang,
  • Kang Huang

摘要

The grinding of microstructures with structured grinding wheels has been demonstrated to result in a substantial enhancement in preparation efficiency. However, when grinding superhard materials such as sapphire, the edges of microstructures are prone to chipping, which has a significant impact on quality. To address this, this paper proposes a tangential ultrasonic vibration grinding technology based on structured grinding wheels, analyzes its separation, motion, and grinding force characteristics, and explores its influence and mechanism of action on the edge integrity and bottom surface quality of sapphire microstructures. Through single-factor experiments combined with response surface methodology, the influence of parameters such as ultrasonic amplitude on surface roughness (Ra) was studied. A regression model was obtained, showing that the order of influence is as follows: feed speed > grinding speed > grinding depth > ultrasonic amplitude. Under optimal parameters, the predicted Ra value is 0.313 μm and the average measured Ra value is 0.322 μm, with a deviation of 2.875%. Compared with conventional grinding, this technology can effectively suppress edge chipping of sapphire microstructures, providing technical support for improving the surface microstructure quality of superhard materials and optimizing process parameters.