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<p>This study examines how substrate bias and deposition geometry influence the structural, mechanical, and electrical properties of ZrCu thin-film metallic glasses (TFMGs). Four film variants were fabricated using RF magnetron sputtering under normal and oblique incidence, with and without a − 75&#xa0;V substrate bias. Structural analysis shows that applying a substrate bias enhances short-range atomic ordering, reduces free volume, and improves intercolumnar cohesion, especially in oblique-incidence films. Mechanical testing reveals that the biased oblique film achieves the highest H/E ratio (~&#xa0;0.0725), delayed crack initiation (~2.12% strain), and the lowest crack density, indicating superior compliance and fracture resistance. Electrical measurements demonstrate that bias-assisted films reduce resistivity by ~ 35% compared to the unbiased oblique film and exhibit improved thermal stability with the lowest temperature coefficient of resistivity (TCR). Overall, combining substrate bias with oblique deposition yields a well-balanced microstructure that enhances both mechanical resilience and electrical efficiency, offering a promising design strategy for flexible electronics, wearable sensors, and other strain-tolerant amorphous metallic devices.</p>

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Morphological and Interfacial Design of ZrCu Thin-Film Metallic Glasses for Enhanced Mechanical and Electrical Properties

  • 期刊论文

  • 发表日期：

    2025年12月5日

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  • Suleiman Ibrahim Mohammad,
  • Asokan Vasudevan,
  • P. S. Raghavendra Rao,
  • Abinash Mahapatro,
  • L. Jino,
  • Ripendeep Singh,
  • Yashwant Singh Bisht

摘要

This study examines how substrate bias and deposition geometry influence the structural, mechanical, and electrical properties of ZrCu thin-film metallic glasses (TFMGs). Four film variants were fabricated using RF magnetron sputtering under normal and oblique incidence, with and without a − 75 V substrate bias. Structural analysis shows that applying a substrate bias enhances short-range atomic ordering, reduces free volume, and improves intercolumnar cohesion, especially in oblique-incidence films. Mechanical testing reveals that the biased oblique film achieves the highest H/E ratio (~ 0.0725), delayed crack initiation (~2.12% strain), and the lowest crack density, indicating superior compliance and fracture resistance. Electrical measurements demonstrate that bias-assisted films reduce resistivity by ~ 35% compared to the unbiased oblique film and exhibit improved thermal stability with the lowest temperature coefficient of resistivity (TCR). Overall, combining substrate bias with oblique deposition yields a well-balanced microstructure that enhances both mechanical resilience and electrical efficiency, offering a promising design strategy for flexible electronics, wearable sensors, and other strain-tolerant amorphous metallic devices.