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<p>Cu-Nb composites represent promising conductor materials for high-field magnet applications, but work hardening during their fabrication significantly reduces material ductility. In this study, annealing-induced recrystallization (400 ~ 800&#xa0;°C) was employed to systematically control the relationship between the microstructure and properties of the wires. When the wire is annealed at temperatures below 500&#xa0;°C, dislocation rearrangement occurs in the copper matrix while the continuous morphology of niobium filaments is maintained, thereby significantly enhancing both the plasticity and electrical conductivity of the material. When the annealing temperature exceeds 500&#xa0;°C, microstructural evolution involving spheroidization of the Nb phase and recrystallization of the Cu matrix leads to a significant reduction in interfacial density, resulting in considerable degradation of the wire’s mechanical properties. At 800&#xa0;°C annealing temperature, the electrical conductivity of the wire increases by approximately 15%, but the interfacial density decreases by about 60%, causing a 40% reduction in strength. Therefore, the 400-500&#xa0;°C range is identified as the optimal annealing process for the wire, which maintains over 90% of the strength while significantly improving both ductility and electrical conductivity, offering a viable strategy for performance tuning of magnet winding materials. These findings could substantially help with the fabrication of a high-performance Cu-Nb composite.</p>

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Tunable Microstructure and Properties of Fiber-Reinforced Cu-Nb Composite through Annealing Process

  • 期刊论文

  • 发表日期：

    2025年12月4日

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  • Yifan Wu,
  • Ziyan Hao,
  • Hongli Hou,
  • Shengnan Zhang,
  • Jianfeng Li,
  • Pengfei Wang

摘要

Cu-Nb composites represent promising conductor materials for high-field magnet applications, but work hardening during their fabrication significantly reduces material ductility. In this study, annealing-induced recrystallization (400 ~ 800 °C) was employed to systematically control the relationship between the microstructure and properties of the wires. When the wire is annealed at temperatures below 500 °C, dislocation rearrangement occurs in the copper matrix while the continuous morphology of niobium filaments is maintained, thereby significantly enhancing both the plasticity and electrical conductivity of the material. When the annealing temperature exceeds 500 °C, microstructural evolution involving spheroidization of the Nb phase and recrystallization of the Cu matrix leads to a significant reduction in interfacial density, resulting in considerable degradation of the wire’s mechanical properties. At 800 °C annealing temperature, the electrical conductivity of the wire increases by approximately 15%, but the interfacial density decreases by about 60%, causing a 40% reduction in strength. Therefore, the 400-500 °C range is identified as the optimal annealing process for the wire, which maintains over 90% of the strength while significantly improving both ductility and electrical conductivity, offering a viable strategy for performance tuning of magnet winding materials. These findings could substantially help with the fabrication of a high-performance Cu-Nb composite.