Experimental Investigation and Optimization on Surface Roughness and Material Deposition Rate in Electrical Discharge Coating of AA5754 Alloy Using Cu-W Composite Electrode
摘要
This study investigates the material deposition rate (MDR) and surface roughness (Ra) in electrical discharge coating (EDC) of 5754 grade aluminum alloy using powder metallurgical copper-tungsten (70%Cu-30%W) composite electrodes, which has not been addressed before. A full factorial experimental design was employed to evaluate the influence of key process variables, specifically pulse-on time, discharge current, and pulse-off time. Coating characteristics were examined by employing 3D profilometry, scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD). The combined approach of analysis of variance (ANOVA), response surface method (RSM), and desirability function analysis (DFA) enabled assessment, predictive modeling and multi-response optimization. Results reveal that discharge peak current is the dominant factor, contributing 51.46 to Ra and 55.77% to MDR. Increasing peak current and pulse duration produced thicker, denser coatings with minimal imperfections, though with higher surface roughness due to deeper craters. Microscopy and XRD confirmed the formation of a strong composite layer containing W, WC, Cu, and Al, with uniform elemental distribution evidenced by EDS mapping. The developed RSM models showed strong predictive accuracy with high R2 values and low P values. Optimal conditions yielded a surface roughness of 5.847 µm and MDR of 0.3874 g/min at 100 µs pulse-on time, 11.47 A peak current, and 50 µs pulse-off time.