Scholarlink

<p>In this study, the static recrystallization behavior of ultrahigh-purity (UHP) AISI 316L austenitic stainless steel designed for semiconductor manufacturing equipment was investigated. Utilizing stress relaxation tests, hot compression experiments, and electron backscatter diffraction (EBSD) analysis, the static recrystallization kinetics and microstructural evolution were systematically examined at deformation temperatures ranging from 850 to 975&#xa0;°C. The static recrystallization behavior of UHP AISI 316L austenitic stainless steel includes both metadynamic and conventional static recrystallization. A concurrent dual-mechanism Avrami-type equation was proposed to describe the recrystallization fraction. Metadynamic recrystallization exhibited a higher Avrami exponent and a significantly lower apparent activation energy, whereas conventional static recrystallization demonstrated a lower Avrami exponent and higher apparent activation energy. An increase in the deformation temperature facilitated metadynamic recrystallization. The recrystallized grains were equiaxed with a large number of twin boundaries. The relationship between grain size and deformation temperature was established using an exponential empirical equation. The non-recrystallization temperature of the experimental steel was below 850&#xa0;°C, which was considered the optimal final forging temperature. Actual forging tests confirmed a reduction in grain size to 21&#xa0;μm, resulting in a yield strength of 414&#xa0;MPa. This study provides critical insights for optimizing the hot-working processes of UHP AISI 316L steel to meet the industrial demands for high-strength semiconductor equipment components.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Static Recrystallization Behavior of Ultrahigh-Purity AISI 316L Stainless Steel

  • 期刊论文

  • 发表日期：

    2025年10月6日

查看全文
  • Hui Luo,
  • Jianyin Weng,
  • Tong Li,
  • Junjie Cheng,
  • Zhanjiang Gao,
  • Jia Wu,
  • Xiangyu Xu

摘要

In this study, the static recrystallization behavior of ultrahigh-purity (UHP) AISI 316L austenitic stainless steel designed for semiconductor manufacturing equipment was investigated. Utilizing stress relaxation tests, hot compression experiments, and electron backscatter diffraction (EBSD) analysis, the static recrystallization kinetics and microstructural evolution were systematically examined at deformation temperatures ranging from 850 to 975 °C. The static recrystallization behavior of UHP AISI 316L austenitic stainless steel includes both metadynamic and conventional static recrystallization. A concurrent dual-mechanism Avrami-type equation was proposed to describe the recrystallization fraction. Metadynamic recrystallization exhibited a higher Avrami exponent and a significantly lower apparent activation energy, whereas conventional static recrystallization demonstrated a lower Avrami exponent and higher apparent activation energy. An increase in the deformation temperature facilitated metadynamic recrystallization. The recrystallized grains were equiaxed with a large number of twin boundaries. The relationship between grain size and deformation temperature was established using an exponential empirical equation. The non-recrystallization temperature of the experimental steel was below 850 °C, which was considered the optimal final forging temperature. Actual forging tests confirmed a reduction in grain size to 21 μm, resulting in a yield strength of 414 MPa. This study provides critical insights for optimizing the hot-working processes of UHP AISI 316L steel to meet the industrial demands for high-strength semiconductor equipment components.