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<p>The corrosion characteristics of alloys play a crucial role in lead (Pb)-free solder applications, with their performance being largely influenced by their composition. In this study, Sn–5Sb–xZn alloys were synthesized using high-purity elements through vacuum-sealed melting at 750&#xa0;°C, followed by homogenization, quenching, and remelting to ensure uniformity. The present work investigates the synthesis and corrosion behavior of Sn-5Sb-xZn (x = 0, 0.5, 1, 1.5, 2, 2.5 wt.%) alloy in 3.5 wt.% NaCl solution (35 grams NaCl/ L) at ambient temperature. The effect of zinc (Zn) addition on microstructure of the Sn-5Sb-xZn alloy was observed. The microstructure reveals that most SbZn and Sb<sub>2</sub>SnZn intermetallic are present in this alloy and refinement of the microstructure has observed in Sn-5Sb alloy. The surface morphology and corrosion product were evaluated using x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), and scanning electron microscopy with energy-dispersive x-ray spectroscopy (SEM-EDS). After corrosion, the products formed such as H<sub>5</sub>Cl<sub>5</sub>O<sub>2</sub>Zn<sub>2</sub>, Cl<sub>2</sub>O<sub>3</sub>Sb<sub>2</sub>Zn<sub>1</sub>, SnO<sub>2</sub>, ZnO, SbSnO<sub>2</sub>, Zn<sub>5</sub>(OH)<sub>8</sub>Cl<sub>2</sub>.H<sub>2</sub>O, and ZnSnSb<sub>2</sub> are due to the electrochemical activity of Zn, Sn, and Sb in a chloride-rich environment. Zn, being more anodic, forms oxides and hydroxy chlorides, while Sn and Sb form more stable oxides or mixed oxides. Complex products arise from interactions between alloy elements and Cl<sup>−</sup> during corrosion, reflecting typical behavior in Sn-Sb-Zn systems exposed to moisture and chlorides. The results of electrochemical impedance spectroscopy (EIS) show corrosion behavior. This shows that up to 2 wt.% Zn addition the microstructure is refined, after which the trend changes. Therefore, an improvement in the corrosion resistance was observed till 2 wt. % Zn as shown by the decreased corrosion current density (Icorr) and increased total resistance (Rt). The excess Zn addition (above 2 wt.%) formed Zn-containing intermetallic compounds (IMCs), which were verified as ZnSb, reducing the corrosion resistance of Sn-5Sb-xZn solders.</p> Graphical Abstract <p></p>

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Effects of Zn Addition on Electrochemical Behavior of Sn-5Sb-xZn Lead-Free Solder Alloy in 3.5 wt.% NaCl Solution

  • 期刊论文

  • 发表日期：

    2025年10月7日

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  • Anju Kaushal,
  • Mukesh Raushan Kumar

摘要

The corrosion characteristics of alloys play a crucial role in lead (Pb)-free solder applications, with their performance being largely influenced by their composition. In this study, Sn–5Sb–xZn alloys were synthesized using high-purity elements through vacuum-sealed melting at 750 °C, followed by homogenization, quenching, and remelting to ensure uniformity. The present work investigates the synthesis and corrosion behavior of Sn-5Sb-xZn (x = 0, 0.5, 1, 1.5, 2, 2.5 wt.%) alloy in 3.5 wt.% NaCl solution (35 grams NaCl/ L) at ambient temperature. The effect of zinc (Zn) addition on microstructure of the Sn-5Sb-xZn alloy was observed. The microstructure reveals that most SbZn and Sb2SnZn intermetallic are present in this alloy and refinement of the microstructure has observed in Sn-5Sb alloy. The surface morphology and corrosion product were evaluated using x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), and scanning electron microscopy with energy-dispersive x-ray spectroscopy (SEM-EDS). After corrosion, the products formed such as H5Cl5O2Zn2, Cl2O3Sb2Zn1, SnO2, ZnO, SbSnO2, Zn5(OH)8Cl2.H2O, and ZnSnSb2 are due to the electrochemical activity of Zn, Sn, and Sb in a chloride-rich environment. Zn, being more anodic, forms oxides and hydroxy chlorides, while Sn and Sb form more stable oxides or mixed oxides. Complex products arise from interactions between alloy elements and Cl− during corrosion, reflecting typical behavior in Sn-Sb-Zn systems exposed to moisture and chlorides. The results of electrochemical impedance spectroscopy (EIS) show corrosion behavior. This shows that up to 2 wt.% Zn addition the microstructure is refined, after which the trend changes. Therefore, an improvement in the corrosion resistance was observed till 2 wt. % Zn as shown by the decreased corrosion current density (Icorr) and increased total resistance (Rt). The excess Zn addition (above 2 wt.%) formed Zn-containing intermetallic compounds (IMCs), which were verified as ZnSb, reducing the corrosion resistance of Sn-5Sb-xZn solders.

Graphical Abstract